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  1. Video Interfaces
    HDMI
  2. Wireless Connectivity
    ONBOARD WI-FI/BLE
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Opzioni
Cpu Maker
  1. Intel 4 elementi
  2. NXP 8 elementi
  3. Qualcomm 1 elemento
  4. Rockchip 1 elemento
Cpu Power Consumption
  1. range < 10 W 5 elementi
Cpu Type
  1. Intel® Atom™ 3 elementi
  2. Intel® Celeron® 1 elemento
  3. Intel® Core™ 1 elemento
  4. Intel® Pentium® 1 elemento
  5. NXP i.MX 8M 3 elementi
  6. NXP i.MX 8M Plus 1 elemento
  7. NXP i.MX 8X 1 elemento
  8. NXP i.MX 93 2 elementi
  9. NXP i.MX6 1 elemento
  10. NXP i.MX8 1 elemento
  11. Rockchip RK3399 1 elemento
Ethernet
  1. ETHERNET≥1 7 elementi
  2. ETHERNET≥2 10 elementi
Form Factor
  1. COM-HPC® 1 elemento
  2. Qseven 1 elemento
  3. SMARC 3 elementi
  4. Trizeps SODIMM SOM 1 elemento
  5. Boxed Solutions 3 elementi
  6. Single Board Computer 5 elementi
Form Factor Dimensions
  1. ≤ 100 x 100mm 7 elementi
  2. ≤ 80 x 80mm 5 elementi
  3. ≥ 100 x 100mm 3 elementi
Form Factor Specification
  1. 3,5" 2 elementi
  2. COM-HPC Client 1 elemento
  3. Other SBCs 1 elemento
  4. Pico-ITX 2 elementi
  5. Qseven 70x70 mm 1 elemento
Memory
  1. memory ≤1 9 elementi
  2. memory ≤16 2 elementi
  3. memory ≤2 9 elementi
  4. memory ≤4 7 elementi
  5. memory ≤8 2 elementi
  6. memory ≥32 1 elemento
  7. soldered down 8 elementi
  8. SO_DIMM 1 elemento
Mass Storage
  1. mSATA half-size slot 1 elemento
  2. standard SATA connector 1 elemento
  3. M.2 NVMe SSD slot 1 elemento
  4. M.2 SATA SSD slot 3 elementi
  5. microSD card slot 4 elementi
  6. onboard eMMC 7 elementi
  7. onboard eMMC 5 elementi
  8. SATA channels ≥ 1 1 elemento
  9. SATA channels ≥ 1 2 elementi
  10. SATA channels ≥ 2 1 elemento
  11. SD interface 3 elementi
  12. SD interface 1 elemento
Operating Temperature
  1. -20°C ÷ +60°C 7 elementi
  2. -40°C ÷ +85°C 8 elementi
  3. 0°C ÷ +50°C 9 elementi
  4. 0°C ÷ +60°C 10 elementi
  5. 20°C ÷ +70°C 7 elementi
  6. -40°C ÷ +60°C 1 elemento
  7. -20°C ÷ +70°C 1 elemento
  8. -20°C ÷ +70°C 1 elemento
Pci Express
  1. PCI-e lanes ≥ 1 5 elementi
  2. PCI-e lanes ≥ 2 2 elementi
  3. PCI-e lanes ≥ 5 1 elemento
Ttl Uarts
  1. TTL Uarts ≥1 6 elementi
  2. TTL Uarts ≥2 6 elementi
  3. TTL Uarts ≥3 3 elementi
USB
  1. USB 2.0 ≥ 1 9 elementi
  2. USB 2.0 ≥ 2 9 elementi
  3. USB 2.0 ≥ 3 6 elementi
  4. USB 2.0 ≥ 4 5 elementi
  5. USB 2.0 ≥ 5 2 elementi
  6. USB 3.0 ≥ 1 8 elementi
  7. USB 3.0 ≥ 2 5 elementi
  8. USB 3.1 ≥ 1 1 elemento
  9. USB 3.2 ≥ 2 1 elemento
  10. USB 4.0 ≥ 4 1 elemento
  11. USB CLIENT 1 elemento
  12. USB OTG 8 elementi
Video Interfaces
  1. DDI 1 elemento
  2. DP 3 elementi
  3. DP++ 3 elementi
  4. DUAL CHANNEL LVDS 12 elementi
  5. eDP 10 elementi
  6. HDMI 15 elementi
  7. MIPI-CSI camera conn 2 elementi
  8. MIPI-DSI 3 elementi
  9. PARALLEL RGB 2 elementi
  10. SINGLE CHANNEL LVDS 16 elementi
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 8 elementi
  2. M.2 SOCKET 2 KEY 4 elementi
  3. M.2 Socket 2 key B 6 elementi
  4. ONBOARD WI-FI/BLE 15 elementi
  5. /Q/7/Q7-C26_70x70mm_1000x1000px_15_1.jpg 1 elemento
Prodotti
  • Computer on Module
  • Single Board Computer
  • Human Machine Interface
  • Fanless Embedded PCs
  • Embedded PCs
  • Payment Systems
  • Kit di sviluppo e accessori
  • AI-Optimized Hardware
  • Display TFT
  • Modular Vision
  • Dev Kits, Carrier Boards and Accessories
  • Evaluation Kit
  • Single Board Computer
  • Touch Display Solution