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  1. USB
    USB 2.0 ≥ 4
  2. Wireless Connectivity
    ONBOARD WI-FI/BLE
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Opzioni
Cpu Maker
  1. Arm System ready NXP 1 elemento
  2. Intel 1 elemento
  3. MediaTek 1 elemento
  4. NXP 4 elementi
  5. Rockchip 1 elemento
Cpu Power Consumption
  1. range < 10 W 5 elementi
Cpu Type
  1. Intel® Core™ 1 elemento
  2. MediaTek Genio 700 1 elemento
  3. NXP i.MX 8M 1 elemento
  4. NXP i.MX 8M Mini 2 elementi
  5. NXP i.MX 8M Nano 1 elemento
  6. NXP i.MX 933/935 1 elemento
  7. NXP i.MX8 1 elemento
  8. Rockchip RK3399 1 elemento
Ethernet
  1. ETHERNET≥1 7 elementi
  2. ETHERNET≥2 5 elementi
Form Factor
  1. COM-HPC® 1 elemento
  2. Qseven 2 elementi
  3. SMARC 2 elementi
  4. Trizeps SODIMM SOM 1 elemento
  5. Single Board Computer 3 elementi
Form Factor Dimensions
  1. 40x70 mm (µQseven, 1.57"x 2.76") 1 elemento
  2. ≤ 100 x 100mm 3 elementi
  3. ≤ 80 x 80mm 3 elementi
  4. ≥ 100 x 100mm 3 elementi
Form Factor Specification
  1. 3,5" 3 elementi
  2. COM-HPC Client 1 elemento
  3. Qseven 70x70 mm 1 elemento
  4. µQseven 70x40 1 elemento
Memory
  1. memory ≤1 6 elementi
  2. memory ≤2 7 elementi
  3. memory ≤4 6 elementi
  4. memory ≤8 2 elementi
  5. memory ≥32 1 elemento
  6. soldered down 7 elementi
  7. SO_DIMM 1 elemento
Mass Storage
  1. M.2 NVMe SSD slot 1 elemento
  2. microSD card slot 4 elementi
  3. onboard eMMC 6 elementi
  4. onboard eMMC 1 elemento
  5. SATA channels ≥ 2 1 elemento
  6. SD interface 2 elementi
  7. SD interface 1 elemento
Operating Temperature
  1. -20°C ÷ +60°C 6 elementi
  2. -40°C ÷ +85°C 6 elementi
  3. 0°C ÷ +50°C 6 elementi
  4. 0°C ÷ +60°C 7 elementi
  5. 20°C ÷ +70°C 5 elementi
  6. -20°C ÷ +70°C 2 elementi
Pci Express
  1. PCI-e lanes ≥ 1 3 elementi
  2. PCI-e lanes ≥ 2 1 elemento
  3. PCI-e lanes ≥ 5 1 elemento
Ttl Uarts
  1. TTL Uarts ≥1 6 elementi
  2. TTL Uarts ≥2 7 elementi
  3. TTL Uarts ≥3 4 elementi
USB
  1. USB 2.0 ≥ 1 17 elementi
  2. USB 2.0 ≥ 2 14 elementi
  3. USB 2.0 ≥ 3 10 elementi
  4. USB 2.0 ≥ 4 9 elementi
  5. USB 2.0 ≥ 5 4 elementi
  6. USB 3.0 ≥ 1 11 elementi
  7. USB 3.0 ≥ 2 6 elementi
  8. USB 3.1 ≥ 1 3 elementi
  9. USB 3.2 ≥ 2 1 elemento
  10. USB 4.0 ≥ 4 1 elemento
  11. USB CLIENT 1 elemento
  12. USB OTG 12 elementi
Video Interfaces
  1. DDI 1 elemento
  2. DP 2 elementi
  3. DP++ 1 elemento
  4. DUAL CHANNEL LVDS 6 elementi
  5. eDP 6 elementi
  6. HDMI 5 elementi
  7. MIPI-CSI camera conn 1 elemento
  8. MIPI-DSI 1 elemento
  9. PARALLEL RGB 1 elemento
  10. SINGLE CHANNEL LVDS 7 elementi
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 5 elementi
  2. M.2 SOCKET 2 KEY 1 elemento
  3. M.2 Socket 2 key B 2 elementi
  4. ONBOARD WI-FI/BLE 9 elementi
  5. /Q/7/Q7-C26_70x70mm_1000x1000px_15_1.jpg 1 elemento
Prodotti
  • Computer on Module
  • Single Board Computer
  • Human Machine Interface
  • Fanless Embedded PCs
  • Embedded PCs
  • Payment Systems
  • Kit di sviluppo e accessori
  • AI-Optimized Hardware
  • Display TFT
  • Modular Vision
  • Dev Kits, Carrier Boards and Accessories
  • Evaluation Kit
  • Single Board Computer
  • Touch Display Solution