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SOM-COM-HPC-A-TGL-UP3Computer on Module (CoM) COM-HPC® Client Size A con processori Intel® Core™ e Celeron® di undicesima generazione (Codename: Tiger Lake-UP3). (CARINA - C77)x86 Computer on Module COM-HPC® Processore Intel -
SOM-COM-HPC-A-RPLCOM-HPC® Client module Size A, with 13th Gen Intel® Core™ processors (Codename: Raptor Lake – H/P/U series). (ORION - D80)x86 Computer on Module COM-HPC® Processore Intel AI-Optimized Hardware -
SBC-3.5-RK3568SBC 3.5” con processore Rockchip RK3568. (SAYLOR - E09)Arm Processore Rockchip Single Board Computer 3.5-inch SBC -
Carrier-Trizeps-pConXSCarrier Board for Trizeps SODIMM SOMsKit di sviluppo e accessori Scheda carrier Carrier Boards per Trizeps SOM Dev Kits, Carrier Boards and Accessories Carrier Boards Trizeps Carrier Boards -
SOM-COMe-CT6-V1000COM Express® Rel. 3.0 Compact Type 6 Computer on Module (CoM) with AMD Ryzen™ Embedded V1000 Processors. (CHARON - B75)x86 COM Express® Processore AMD -
SOM-COMe-CT6-TWLCOM Express Rel. 3.1 Type 6 Module with Intel® Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Twin Lake). (E90)x86 COM Express® Processore Intel