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HD57-DISS-3-PKCOM HPC TIGER LAKE H I7 Heat sink (ACTIVE) - PackagedKit di sviluppo e accessori Accessori Dissipatori Dev Kits, Carrier Boards and Accessories Accessories Heat Spreaders -
DEV-KIT-COM-HPC-ACross Platform Development Kit compatible with both x86 and ARM COM-HPC Client modulesKit di sviluppo e accessori Kit di sviluppo e kit di avvio COM-HPC Development Kit Dev Kits, Carrier Boards and Accessories Starter and Development Kits COM-HPC Development Kit -
Carrier-SMARC-2.0-B79Carrier board for SMARC rel. 2.0 / 2.1.1 compliant modules RB79Kit di sviluppo e accessori Scheda carrier Carrier Board per standard SMARC Dev Kits, Carrier Boards and Accessories Carrier Boards SMARC Carrier Boards -
SOM-COMe-CT6-V1000COM Express® Rel. 3.0 Compact Type 6 Computer on Module (CoM) with AMD Ryzen™ Embedded V1000 Processors. (CHARON - B75)x86 COM Express® Processore AMD -
SOM-COMe-CT6-TWLCOM Express Rel. 3.1 Type 6 Module with Intel® Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Twin Lake). (E90)x86 COM Express® Processore Intel -
SOM-COMe-CT6-TGL-UCOM Express® Rel. 3.0 Compact Type 6 Computer on Module (CoM) with 11th Gen Intel® Core™ (Codename: Tiger Lake UP3) Processors. (CALYPSO - D40)x86 COM Express® Processore Intel