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  1. Operating Temperature
    0°C ÷ +50°C
  2. Wireless Connectivity
    M.2 SOCKET 2 KEY
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Opzioni
Cpu Maker
  1. AMD 2 elementi
  2. Intel 3 elementi
  3. NXP 3 elementi
  4. Rockchip 1 elemento
Cpu Power Consumption
  1. range 10-25 W 4 elementi
  2. range < 10 W 4 elementi
  3. range > 25 W 1 elemento
Cpu Type
  1. AMD Ryzen™ Embedded 2 elementi
  2. AMD® Ryzen™ embedded 2 elementi
  3. Intel® Atom™ 2 elementi
  4. Intel® Celeron® 2 elementi
  5. Intel® Pentium® 2 elementi
  6. NXP i.MX 8M 1 elemento
  7. NXP i.MX6 1 elemento
  8. NXP i.MX8 1 elemento
  9. Rockchip RK3568 1 elemento
Ethernet
  1. ETHERNET≥1 7 elementi
  2. ETHERNET≥2 6 elementi
Form Factor
  1. Boxed Solutions 4 elementi
  2. Single Board Computer 5 elementi
Form Factor Dimensions
  1. ≥ 100 x 100mm 7 elementi
Form Factor Specification
  1. 3,5" 4 elementi
Memory
  1. memory ≤1 7 elementi
  2. memory ≤16 3 elementi
  3. memory ≤2 8 elementi
  4. memory ≤4 6 elementi
  5. memory ≤8 5 elementi
  6. memory ≥32 2 elementi
  7. soldered down 6 elementi
  8. SO_DIMM 2 elementi
Mass Storage
  1. onboard SSD 1 elemento
  2. M.2 NVMe SSD slot 2 elementi
  3. M.2 SATA SSD slot 2 elementi
  4. microSD card slot 5 elementi
  5. onboard eMMC 6 elementi
  6. onboard eMMC 1 elemento
  7. SATA channels ≥ 1 3 elementi
  8. SATA channels ≥ 2 1 elemento
Operating Temperature
  1. -20°C ÷ +60°C 3 elementi
  2. -40°C ÷ +85°C 5 elementi
  3. 0°C ÷ +50°C 9 elementi
  4. 0°C ÷ +60°C 9 elementi
  5. 20°C ÷ +70°C 2 elementi
Pci Express
  1. PCI-e lanes ≥ 1 2 elementi
  2. PCI-e lanes ≥ 2 2 elementi
  3. PCI-e lanes ≥ 3 1 elemento
  4. PCI-e lanes ≥ 4 1 elemento
  5. PCI-e lanes ≥ 5 1 elemento
Ttl Uarts
  1. TTL Uarts ≥1 3 elementi
  2. TTL Uarts ≥2 3 elementi
  3. TTL Uarts ≥3 1 elemento
USB
  1. USB 2.0 ≥ 1 6 elementi
  2. USB 2.0 ≥ 2 4 elementi
  3. USB 2.0 ≥ 3 2 elementi
  4. USB 2.0 ≥ 4 1 elemento
  5. USB 2.0 ≥ 5 1 elemento
  6. USB 3.0 ≥ 1 5 elementi
  7. USB 3.0 ≥ 2 3 elementi
  8. USB 3.0 ≥ 3 1 elemento
  9. USB 3.2 ≥ 2 1 elemento
  10. USB OTG 1 elemento
Video Interfaces
  1. DP 1 elemento
  2. DP++ 5 elementi
  3. DUAL CHANNEL LVDS 3 elementi
  4. eDP 3 elementi
  5. HDMI 3 elementi
  6. SINGLE CHANNEL LVDS 3 elementi
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 16 elementi
  2. M.2 SOCKET 2 KEY 9 elementi
  3. M.2 Socket 2 key B 7 elementi
  4. ONBOARD WI-FI/BLE 16 elementi
  5. /Q/7/Q7-C26_70x70mm_1000x1000px_15_1.jpg 1 elemento
  6. /s/n/snapdragon-x_per_sito.jpg 1 elemento
Prodotti
  • Computer on Module
  • Single Board Computer
  • Human Machine Interface
  • Fanless Embedded PCs
  • Embedded PCs
  • Payment Systems
  • Kit di sviluppo e accessori
  • AI-Optimized Hardware
  • Display TFT
  • Modular Vision
  • Dev Kits, Carrier Boards and Accessories
  • Evaluation Kit
  • Single Board Computer
  • Touch Display Solution