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  1. Mass Storage
    SATA channels ≥ 2
  2. Operating Temperature
    0°C ÷ +60°C
  3. Pci Express
    PCI-e lanes ≥ 4
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Opzioni
Cpu Maker
  1. AMD 1 elemento
Cpu Power Consumption
  1. range 10-25 W 1 elemento
  2. range > 25 W 1 elemento
Cpu Type
  1. AMD Ryzen™ Embedded 1 elemento
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 elemento
  2. ≤ 100 x 100mm 1 elemento
Form Factor Specification
  1. COM Express Basic 1 elemento
  2. COM Express Compact 1 elemento
Memory
  1. memory ≥32 1 elemento
  2. SO_DIMM 1 elemento
Mass Storage
  1. CFAST slot 1 elemento
  2. M.2 NVMe SSD slot 4 elementi
  3. M.2 SATA SSD slot 1 elemento
  4. microSD card slot 5 elementi
  5. onboard eMMC 13 elementi
  6. onboard eMMC 1 elemento
  7. SATA channels ≥ 1 22 elementi
  8. SATA channels ≥ 1 1 elemento
  9. SATA channels ≥ 2 2 elementi
  10. SATA channels ≥ 2 16 elementi
  11. SATA channels ≥ 3 2 elementi
  12. SATA channels ≥ 4 1 elemento
  13. SD interface 6 elementi
  14. SD interface 1 elemento
  15. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 elemento
Operating Temperature
  1. -40°C ÷ +85°C 2 elementi
  2. 0°C ÷ +60°C 2 elementi
Pci Express
  1. PCI-e lanes ≥ 1 2 elementi
  2. PCI-e lanes ≥ 2 2 elementi
  3. PCI-e lanes ≥ 3 1 elemento
  4. PCI-e lanes ≥ 4 2 elementi
  5. PCI-e lanes ≥ 5 3 elementi
Ttl Uarts
  1. TTL Uarts ≥1 1 elemento
  2. TTL Uarts ≥2 1 elemento
USB
  1. USB 2.0 ≥ 6 1 elemento
  2. USB 3.1 ≥ 2 1 elemento
Video Interfaces
  1. DDI 1 elemento
  2. DP 1 elemento
  3. DUAL CHANNEL LVDS 1 elemento
  4. eDP 1 elemento
  5. HDMI 1 elemento
  6. SINGLE CHANNEL LVDS 1 elemento
Prodotti
  • Computer on Module
  • Single Board Computer
  • Human Machine Interface
  • Fanless Embedded PCs
  • Embedded PCs
  • Payment Systems
  • Kit di sviluppo e accessori
  • AI-Optimized Hardware
  • Display TFT
  • Modular Vision
  • Dev Kits, Carrier Boards and Accessories
  • Evaluation Kit
  • Single Board Computer
  • Touch Display Solution