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  1. Mass Storage
    microSD card slot
  2. Video Interfaces
    DUAL CHANNEL LVDS
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Opzioni
Cpu Maker
  1. Arm System ready NXP 1 elemento
  2. Intel 2 elementi
  3. NVIDIA 1 elemento
  4. NXP 5 elementi
  5. Rockchip 2 elementi
Cpu Power Consumption
  1. range 10-25 W 2 elementi
  2. range < 10 W 7 elementi
Cpu Type
  1. Intel® Atom™ 1 elemento
  2. Intel® Celeron® 2 elementi
  3. Intel® Core™ 1 elemento
  4. Intel® Pentium® 1 elemento
  5. NVIDIA Tegra® T30 1 elemento
  6. NXP i.MX 8M 1 elemento
  7. NXP i.MX 8M Mini 1 elemento
  8. NXP i.MX6 3 elementi
  9. NXP i.MX8 1 elemento
  10. Rockchip RK3399 1 elemento
  11. Rockchip RK3568 1 elemento
Ethernet
  1. ETHERNET≥1 11 elementi
  2. ETHERNET≥2 7 elementi
Form Factor
  1. COM Express® 1 elemento
  2. Qseven 3 elementi
  3. SMARC 2 elementi
  4. Single Board Computer 7 elementi
Form Factor Dimensions
  1. ≤ 100 x 100mm 5 elementi
  2. ≤ 80 x 80mm 4 elementi
  3. ≥ 100 x 100mm 5 elementi
Form Factor Specification
  1. 3,5" 4 elementi
  2. COM Express Compact 1 elemento
  3. Other SBCs 1 elemento
  4. Pico-ITX 1 elemento
  5. Qseven 70x70 mm 3 elementi
Memory
  1. memory ≤1 9 elementi
  2. memory ≤16 1 elemento
  3. memory ≤2 10 elementi
  4. memory ≤4 8 elementi
  5. memory ≤8 3 elementi
  6. memory ≥32 1 elemento
  7. soldered down 8 elementi
  8. SO_DIMM 1 elemento
Mass Storage
  1. mSATA half-size slot 1 elemento
  2. onboard SSD 2 elementi
  3. standard SATA connector 1 elemento
  4. soldered down 1 elemento
  5. CFAST slot 1 elemento
  6. M.2 NVMe SSD slot 3 elementi
  7. M.2 SATA SSD slot 7 elementi
  8. microSD card slot 14 elementi
  9. onboard eMMC 1 elemento
  10. onboard eMMC 29 elementi
  11. onboard eMMC 7 elementi
  12. SATA channels ≥ 1 21 elementi
  13. SATA channels ≥ 2 1 elemento
  14. SATA channels ≥ 2 3 elementi
  15. SATA channels ≥ 2 12 elementi
  16. SATA channels ≥ 3 3 elementi
  17. SATA channels ≥ 4 1 elemento
  18. SD interface 13 elementi
  19. SD interface 8 elementi
  20. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 2 elementi
Operating Temperature
  1. -20°C ÷ +60°C 7 elementi
  2. -40°C ÷ +85°C 7 elementi
  3. 0°C ÷ +50°C 9 elementi
  4. 0°C ÷ +60°C 11 elementi
  5. 20°C ÷ +70°C 7 elementi
Pci Express
  1. PCI-e lanes ≥ 1 5 elementi
  2. PCI-e lanes ≥ 2 4 elementi
  3. PCI-e lanes ≥ 3 2 elementi
  4. PCI-e lanes ≥ 4 3 elementi
  5. PCI-e lanes ≥ 5 1 elemento
Ttl Uarts
  1. TTL Uarts ≥1 6 elementi
  2. TTL Uarts ≥2 5 elementi
  3. TTL Uarts ≥3 2 elementi
USB
  1. USB 2.0 ≥ 1 12 elementi
  2. USB 2.0 ≥ 2 8 elementi
  3. USB 2.0 ≥ 3 7 elementi
  4. USB 2.0 ≥ 4 7 elementi
  5. USB 2.0 ≥ 5 5 elementi
  6. USB 2.0 ≥ 6 2 elementi
  7. USB 3.0 ≥ 1 6 elementi
  8. USB 3.0 ≥ 2 3 elementi
  9. USB 3.1 ≥ 1 2 elementi
  10. USB 3.1 ≥ 2 1 elemento
  11. USB OTG 8 elementi
Video Interfaces
  1. DDI 2 elementi
  2. DP 7 elementi
  3. DP++ 7 elementi
  4. DUAL CHANNEL LVDS 14 elementi
  5. eDP 10 elementi
  6. HDMI 19 elementi
  7. MIPI-CSI camera conn 3 elementi
  8. SINGLE CHANNEL LVDS 12 elementi
  9. VGA 2 elementi
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 2 elementi
  2. M.2 SOCKET 2 KEY 3 elementi
  3. M.2 Socket 2 key B 1 elemento
  4. ONBOARD WI-FI/BLE 4 elementi
Prodotti
  • Computer on Module
  • Single Board Computer
  • Human Machine Interface
  • Fanless Embedded PCs
  • Embedded PCs
  • Payment Systems
  • Kit di sviluppo e accessori
  • AI-Optimized Hardware
  • Display TFT
  • Modular Vision
  • Dev Kits, Carrier Boards and Accessories
  • Evaluation Kit
  • Single Board Computer
  • Touch Display Solution