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SOM-Q7-APLComputer on Module (CoM) Qseven® Rel. 2.1 con processori Intel® Atom® serie X, Intel® Celeron® serie J/N e Intel® Pentium® serie N (Codename: Apollo Lake) Processors. (NAOS - B03)x86 Computer on Module Qseven® Processore Intel -
SOM-COM-HPC-A-TGL-UP3Computer on Module (CoM) COM-HPC® Client Size A con processori Intel® Core™ e Celeron® di undicesima generazione (Codename: Tiger Lake-UP3). (CARINA - C77)x86 Computer on Module COM-HPC® Processore Intel -
SBC-eNUC-APLSBC embedded NUC™ con processori Intel® Atom® serie X, Intel® Celeron® serie J/N e Intel® Pentium® serie N (codename: Apollo Lake). (ALVIN - B68)x86 Processore Intel Single Board Computer Embedded NUC SBC -
HD57-DISS-3-PKCOM HPC TIGER LAKE H I7 Heat sink (ACTIVE) - PackagedKit di sviluppo e accessori Accessori Dissipatori Dev Kits, Carrier Boards and Accessories Accessories Heat Spreaders -
Palladio 500 RPL AIModular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 GraphicsProcessori Processore Intel Fanless Embedded PCs AI-Optimized Hardware -
SOM-COMe-CT6-TWLCOM Express Rel. 3.1 Type 6 Module with Intel® Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Twin Lake). (E90)x86 COM Express® Processore Intel