Dettagli Prodotto
Descrizione | The Development Kit contains the following material: - CSM-B79 Carrier Board - Serial Adapter Cables - 1x SATA power cable - Main power Adapter cable - 1x certified High Speed DP cable, DP1.4 standard compliant - 1x certified High Speed HDMI® cable, HDMI® 2.0 compliant - DP-to-HDMI® adapter - 1x eDP cable Module not included. Must be purchased separately |
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Interfacce video | LVDS/MIPI-DSI connector, interface shared with 2x eDP connectors |
Memoria di massa | SATA M 7p connector with dedicated power connector, |
Rete | Up to 2xDual RJ-45 Gigabit Ethernet connectors |
USB | 1 x USB 3.0 type A Socket |
Pci | PCI-e x4 slot, interface shared with M.2 Slots
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Audio | TRSS Mic In + Line Out Audio Jack I2S Audio header |
Porte seriali | 2 x CAN ports |
Altre interfacce | eSPI pin header + Flash Socket |
Dispositivo di alimentazione | 9-24V through dedicated Mini-Fit Jr 2x2 power connector or USB Type-C connector RTC Coin cell battery holder |
Temperatura operativa | -40°C ÷ +85°C (industrial range)
*All carrier board components must remain within the operating temperature at any and all times, including start-up; carrier operating temperature is independent of the module installed. Please refer to the specific module for more details. Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system. |
Dimensioni | 243.84 x 243.84mm (microATX) |
KTDV-SM-B79.00 | Descrizione Part Number SMARC Cross Platform Development Kit |
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