SOM-COMe-CT6-R8000
Höhepunkte
GraphicsIntegrated AMD RDNA 3 graphics with up to 6 WGPs
Memory2x DDR5-5600 SODIMM Slots
ConnectivityAI ACCELERATOR: Embedded XDNA Neural Processing Unit (NPU)
Security & Compliance by Design
SECO products integrate security functions that enable out-of-the-box compliance with the RED directive [EN18031-1]. Certification documentation is available upon request. Security monitoring, patching and update automation are powered by Clea.
Secure Boot
Built-in Secure Boot to ensure system integrity from the first startup.
OTA Updates
Remote and secure software update distribution for your devices.
Device Monitoring
Continuous monitoring of device status and activity with Clea.
Secure Operating System
Yocto-based OS integration for customizable and secure system builds.
Certified Security
Compliance with EN18031-1 standards for secure and reliable embedded systems.
Docker Technology
Isolated and flexible application management through containerization.
Applications Hub
Entdecken Sie die mit diesem Produkt kompatiblen Anwendungen, die im SECO Application Hub verfügbar sind: einsatzbereite Lösungen zur Beschleunigung der Entwicklung und Bereitstellung intelligenter Funktionen.
Machine Alert Assistance with Operator Recognition
HMI system that uses AI to recognize operators during alerts and show personalized troubleshooting instructions.
People Counter
Lightweight real-time people counting model based on quantized YOLOX, optimized for edge devices using LiteRT (TensorFlow Lite) .
PoseNet for Multi-Person Pose Detection
Lightweight and quantized PoseNet model for real-time multi-person pose estimation on edge hardware.
HRNet for Human Pose Estimation
High-resolution neural network for accurate keypoint detection in human pose estimation tasks.
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COM Express® 3.1 Type 6 Compact Module mit AMD Ryzen™ Embedded 8000 Series. (F07) |
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AMD Ryzen™ Embedded 8000 Series Processors: AMD Ryzen™ 7 Pro 8845HS – 8 Cores / 16 Threads @ 3.8 GHz (5.1 GHz Turbo), 6 WGPs, TDP 45W (35–54W) AMD Ryzen™ 5 Pro 8645HS – 6 Cores / 12 Threads @ 4.3 GHz (5.0 GHz Turbo), 4 WGPs, TDP 45W (35–54W) AMD Ryzen™ 7 Pro 8840U – 8 Cores / 16 Threads @ 3.3 GHz (5.1 GHz Turbo), 6 WGPs, TDP 28W (15–30W) AMD Ryzen™ 5 Pro 8640U – 6 Cores / 12 Threads @ 3.5 GHz (4.9 GHz Turbo), 4 WGPs, TDP 28W (15–30W) |
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2x DDR5-5600 SODIMM Slots |
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Integrated AMD RDNA 3 graphics with up to 6 WGPs (Work Group processors) |
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Up to 4 independent displays. 2x DDI interfaces supporting DP 2.0, HDMI 2.1, DP Alt Mode over Type-C 1x DDI interface supporting DP 2.0 / HDMI 2.1 eDP 1.5 or LVDS Single/Dual Channel interfaces (factory alternatives) |
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HDMI: Max 8K60 DP: Max 7680x4320 @60Hz eDP, USB-C DP Alt: Max 3840x2160 @240Hz LVDS: Max 1920x1200 Max resolution: 4 x 3840x2160 @60Hz |
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2x USB 40Gbps interfaces 2x USB 10Gbps interfaces (without USB Hub) 1x USB 10Gbps + 3x USB 5Gbps interfaces (with USB Hub) 8x Hi-Speed USB |
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8x PCIe Gen 4 lanes (max 6 root ports) 1x8 or 2x4 PCI-e Graphics (PEG) Gen4 port |
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HD Audio interface, Soundwire interface |
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2x 2-wires serial ports |
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SPI, I²C, SM Bus, thermal management, FAN management LPC bus TPM 2.0 on-board (factory option) LID#/SLEEP#/PWRBTN#, watchdog 4x GPI, 4x GPO |
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Main Power: +12Vdc ± 10% Auxiliary: +5V_SBY, +3V_RTC |
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SECO Clea OS Microsoft® Windows 11 IoT Enterprise |
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0°C ÷ +60°C (Commercial version) |
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95 x 95 mm (Com Express® Compact Form factor, Type 6 pinout) |
Teilenummer
COM Express® 3.1 Type 6 Compact Module with AMD Ryzen™nEmbedded 8000 Series