DE
EN - € 
ES 
FR 
IT 
JP 
USA 
ZH 
SOM-COMe-CT6-ADL-N
COM Express® 3.1 Type 6 Compact Module with Intel Atom® Processors x7000RE Series (Codename: Alder Lake N)
Available in Industrial Temperature Range
CPU
Intel® Atom® Processors x7000E Series, Intel® Processor N series and Intel® Core™ i3 N305 Processor
Grafiken
Integrated Intel® Gen12 UHD graphics controller with up to 32 EU
Konnektivität
1x NBase-T 2.5GbE; up to 2x USB 10Gbps + 3x USB 5Gbps; 8x Hi-Speed USB; 6x PCI-e lanes Gen3
Speicher
One SO-DIMM slot supporting DDR5-4800 IBECC memory, up to 16GB
Produktbeschreibung
Beschreibung
|
COM Express® 3.1 Type 6 Compact Module with Intel Atom® Processors x7000RE Series (Codename: Alder Lake N) |
|---|---|
CPU
|
Intel Atom® Processors x7000E (Codename: Alder Lake N) Embedded E Series: • Intel Atom® x7425E Quad Core @1.5GHz (3.4GHZ turbo) 12W TDP w/ TSN and TCC, commercial • Inte Atom® x7213E Dual Core @1.7GHz (3.2GHZ turbo) 10W TDP w/ TSN and TCC, commercial • Intel Atom® x7211E Dual Core @1GHz (3.2GHZ turbo) 6W TDP w/ TSN TCC, commercial Intel® Core™ i3 Processors and Intel® Processor N Series (Codename: Alder Lake N) PC Client Processors: • Intel® Core™ i3-N305 Eight Core @1GHz / 1.8GHz (3.8GHZ turbo) 9W/15W TDP w/o TSN and w/o TCC, commercial • Intel® Processor N200 Quad Core @1GHz (3.7GHZ turbo) 6W TDP w/o TSN and w/o TCC - commercial • Intel® Processor N97 Quad Core @2GHz (3.6GHZ turbo) 12W TDP w/o TSN and w/o TCC - commercial • Intel® Processor N50 Dual Core @1GHz (3.4GHZ turbo) 6W TDP w/o TSN and w/o TCC - commercial (*) TCC: Time Coordinated Computing (**) TSN: Time Sensitive Networking |
|
Speicher
|
One DDR5 SO-DIMM slot supporting DDR5-4800 IBECC modules, up to 16GB
|
|
Grafiken
|
Integrated Intel® Gen12 UHD graphics controller with up to 32 EU |
Videoschnittstellen
|
2x Digital Display Interfaces (DDIs), supporting DP, HDMI®, DP Alt-Mode over Type-C |
Videoauflösung
|
HDMI®: up to 4Kx2K @60Hz according to HDMI 2.0b |
Massenspeicher
|
Up to 2x S-ATA Gen3 channels |
Networking
|
1x NBase-T Ethernet interface with MaxLinear GPY211/215 GbE controller, supporting 2.5GbE and TSN |
USB
|
Up to 2x USB 10Gbps |
|
Pci
|
Up to 6x PCI-e Gen3 lanes |
Audio
|
HD Audio interface |
Serielle Schnittstellen
|
2x UARTs |
Andere Schnittstellen
|
SPI, 2x I2C, SM Bus, Thermal Management, FAN management |
Stromversorgung
|
+12VDC ± 10%, +5VSB (optional), +3VRTC (optional) |
Betriebssystem
|
Microsoft® Windows 10 IoT Enterprise 2019 LTSC |
Betriebstemperatur
|
0°C ÷ +60°C (Commercial version)
* Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated. |
Größe
|
95 x 95 mm (COM Express® Compact Form factor, Type 6 pinout) |
Verwandte Produkte
Sie haben nicht die Lösung gefunden, nach der Sie gesucht haben?
Das Standardprodukt erfüllt nicht Ihre Anforderungen? SECO bietet Ihnen die Möglichkeit, gemeinsam mit Ihnen eine teilweise oder komplett kundenspezifisch angepasste Hardware- und Softwarelösung zu entwickeln.
Mehr erfahren
