SOM-COMe-CT6-ADL-N
Höhepunkte
GraphicsIntegrated Intel® Gen12 UHD graphics controller with up to 32 EU
MemoryOne SO-DIMM slot supporting DDR5-4800 IBECC memory, up to 16GB
Entdecken Sie unsere Kits
Starten Sie Ihre Evaluierung
Beginnen Sie mit der Evaluierung des SOM-COMe-CT6-ADL-N mit einem vollständigen, sofort einsatzbereiten Setup, das für erste Tests und die Entwicklung konzipiert ist. Unser limitiertes Evaluierungskit bietet eine vordefinierte Hardwarekonfiguration, mit der Sie die Leistung validieren und die Funktionen des Moduls erkunden können. Das Kit umfasst ein Carrier Board, Speicher, Netzteil und Verkabelung, Speichermedien sowie eine thermische Lösung.
Preis ab €529,90.
BESTELLEN SIE IHR KIT
Security & Compliance by Design
SECO products integrate security functions that enable out-of-the-box compliance with the RED directive [EN18031-1]. Certification documentation is available upon request. Security monitoring, patching and update automation are powered by Clea.
Secure Boot
Built-in Secure Boot to ensure system integrity from the first startup.
OTA Updates
Remote and secure software update distribution for your devices.
Device Monitoring
Continuous monitoring of device status and activity with Clea.
Secure Operating System
Yocto-based OS integration for customizable and secure system builds.
Certified Security
Compliance with EN18031-1 standards for secure and reliable embedded systems.
Docker Technology
Isolated and flexible application management through containerization.
Applications Hub
Entdecken Sie die mit diesem Produkt kompatiblen Anwendungen, die im SECO Application Hub verfügbar sind: einsatzbereite Lösungen zur Beschleunigung der Entwicklung und Bereitstellung intelligenter Funktionen.
Machine Alert Assistance with Operator Recognition
HMI system that uses AI to recognize operators during alerts and show personalized troubleshooting instructions.
People Counter
Lightweight real-time people counting model based on quantized YOLOX, optimized for edge devices using LiteRT (TensorFlow Lite) .
PoseNet for Multi-Person Pose Detection
Lightweight and quantized PoseNet model for real-time multi-person pose estimation on edge hardware.
HRNet for Human Pose Estimation
High-resolution neural network for accurate keypoint detection in human pose estimation tasks.
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COM Express® 3.1 Type 6 Compact Module mit Intel Atom® Prozessoren x7000RE Series (Codename: Alder Lake N). (E90) |
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Intel Atom® Processors x7000E (Codename: Alder Lake N) – Embedded E Series: Intel Atom® x7425E – Quad Core @1.5 GHz (3.4 GHz Turbo), 12W TDP, w/ TSN and TCC, commercial Intel Atom® x7213E – Dual Core @1.7 GHz (3.2 GHz Turbo), 10W TDP, w/ TSN and TCC, commercial Intel Atom® x7211E – Dual Core @1.0 GHz (3.2 GHz Turbo), 6W TDP, w/ TSN and TCC, commercial Intel® Core™ i3 Processors and Intel® Processor N Series (Codename: Alder Lake N) – PC Client Processors: Intel® Core™ i3-N305 – Eight Core @1.0 / 1.8 GHz (3.8 GHz Turbo), 9W / 15W TDP, w/o TSN and w/o TCC, commercial Intel® Processor N200 – Quad Core @1.0 GHz (3.7 GHz Turbo), 6W TDP, w/o TSN and w/o TCC, commercial Intel® Processor N97 – Quad Core @2.0 GHz (3.6 GHz Turbo), 12W TDP, w/o TSN and w/o TCC, commercial Intel® Processor N50 – Dual Core @1.0 GHz (3.4 GHz Turbo), 6W TDP, w/o TSN and w/o TCC, commercial
(*) TCC: Time Coordinated Computing |
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One DDR5 SO-DIMM slot supporting DDR5-4800 IBECC modules, up to 16GB
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Integrated Intel® Gen12 UHD graphics controller with up to 32 EU |
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2x Digital Display Interfaces (DDIs), supporting DP, HDMI®, DP Alt-Mode over Type-C |
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HDMI®: up to 4Kx2K @60Hz according to HDMI 2.0b |
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Up to 2x S-ATA Gen3 channels |
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1x NBase-T Ethernet interface with MaxLinear GPY211/215 GbE controller, supporting 2.5GbE and TSN |
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Up to 2x USB 10Gbps |
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Up to 6x PCI-e Gen3 lanes |
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HD Audio interface |
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2x UARTs |
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SPI, 2x I2C, SM Bus, Thermal Management, FAN management |
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+12VDC ± 10%, +5VSB (optional), +3VRTC (optional) |
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Microsoft® Windows 10 IoT Enterprise 2019 LTSC |
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0°C ÷ +60°C (Commercial version)
* Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated. |
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95 x 95 mm (COM Express® Compact Form factor, Type 6 pinout) |
Teilenummer
COM Express 3.1 Alder Lake Intel® Core i3-N305, 2x PCIe x2 + SATA0/1, eMMC 64GB, LVDS, USB HUB, TPM 2.0, LPC - Comm. Temp
COM Express 3.1 Alder Lake Intel® Atom x7211E, 2x PCIe x2 + SATA0/1, eDP, USB HUB, TPM 2.0, eSPI - Comm. Temp
COM Express 3.1 Alder Lake Intel® N97, 2x PCIe x2 + SATA0/1, LVDS, USB HUB, TPM 2.0, LPC - Comm. Temp
COM Express 3.1 Alder Lake Intel® N50, 2x PCIe x2 + SATA0/1, eDP, no USB HUB, eSPI - Comm. Temp