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SOM-COMe-BT6-RPL-P
Höhepunkte
Graphicsembedded Intel® Iris® Xe graphics with up to 96 execution units
MemoryTwo DDR5 SO-DIMM Slots supporting DDR5-4800 IBECC Memory, up to 64GB
Security & Compliance by Design
SECO products integrate security functions that enable out-of-the-box compliance with the RED directive [EN18031-1]. Certification documentation is available upon request. Security monitoring, patching and update automation are powered by Clea.
Secure Boot
Built-in Secure Boot to ensure system integrity from the first startup.
OTA Updates
Remote and secure software update distribution for your devices.
Device Monitoring
Continuous monitoring of device status and activity with Clea.
Secure Operating System
Yocto-based OS integration for customizable and secure system builds.
Certified Security
Compliance with EN18031-1 standards for secure and reliable embedded systems.
Docker Technology
Isolated and flexible application management through containerization.
Applications Hub
Entdecken Sie die mit diesem Produkt kompatiblen Anwendungen, die im SECO Application Hub verfügbar sind: einsatzbereite Lösungen zur Beschleunigung der Entwicklung und Bereitstellung intelligenter Funktionen.
Machine Alert Assistance with Operator Recognition
HMI system that uses AI to recognize operators during alerts and show personalized troubleshooting instructions.
People Counter
Lightweight real-time people counting model based on quantized YOLOX, optimized for edge devices using LiteRT (TensorFlow Lite) .
PoseNet for Multi-Person Pose Detection
Lightweight and quantized PoseNet model for real-time multi-person pose estimation on edge hardware.
HRNet for Human Pose Estimation
High-resolution neural network for accurate keypoint detection in human pose estimation tasks.
Beschreibung
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COM Express® 3.1 Type 6 Basic Computer on Module (CoM) mit 13th Gen Intel® Core™-Prozessoren (formerly codenamed Raptor Lake-P) |
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CPU Description
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13th Gen Intel® Core™ processors (Raptor Lake U/P/H series) and Intel® Processor U300E:
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Memory Description
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Two DDR5 SO-DIMM slots supporting DDR5-4800, IBECC modules memory, up to 64GB |
Graphics Description
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Intel® UHD Graphics/Intel® Iris® Xe Graphics architecture, up to 96 EU Improved image (IPU6EP) and video processing (AV1/GNA 3.0) Support up to 4 independent displays @ 4K |
Video Interfaces Description
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Up to 3x Digital Display Interfaces (DDIs), supporting DVI, DP 1.4, HDMI 2.1 1x VGA (factory option) 1x eDP 1.3 or single/dual-channel 18-/24-bit LVDS interface (factory alternatives) |
Video Resolution Description
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HDMI and DP up to 8K @ 60Hz via TCSS with Hayden Bridge eDP 1.4b up to 5K @ 120Hz (HBR3 with VDSC1.1) LVDS up to 1920x1200 @ 60Hz |
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Mass Storage Description
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2x SATA Gen3 channels Up to 128 GB on-board NVMe SSD (factory alternative to one PCI-express Graphics (PEG) x4 Gen4) |
Networking Description
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1x NBase-T Ethernet interface with Intel® I225 GbE controller, with TSN and 2.5GbE supported. |
USB Description
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Up to 2x USB 4 Gen2 host ports (depending on carrier board retimer implementation) 4x USB 3.2 Gen2 (10Gbps) host ports (depending on carrier board retimer implementation) 8x USB 2.0 host ports |
PCI Description
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Up to 8x PCI-e x1 Gen3 lanes 1x PCI-express Graphics (PEG) x8 Gen4 Up to 2x PCI-express Graphics (PEG) x4 Gen4 |
Audio Description
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HD audio and Soundwire/i2S audio interfaces |
Serial Ports
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2x UARTs |
Other Interfaces
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SPI, I2C, SM Bus, Thermal Management, FAN management Optional eSPI or LPC bus (factory alternatives) Optional TPM 2.0 on-board LID#/SLEEP#/PWRBTN#, Watchdog 4 x GPI, 4 x GPO |
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Power Supply
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8VDC..20VDC, +5VSB (optional), +3VRTC (optional) |
Operating System
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Microsoft® Windows 10 Linux Ubuntu |
Operating Temperature Description
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0°C to +60°C (commercial version)* -40°C to +85°C (industrial version)*
*Measured at any point of SECO standard heatspreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated. |
Dimensions
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125 x 95 mm (COM Express® Basic Form factor, Type 6 pinout) |
Teilenummer
Intel® Core™ i7-13800HRE Raptor Lake H 45W, 14 (6P+8E) cores (96 EU, 24M Cache, up to 5.00 GHz, vPro, IBECC, IND), BGA1744 - Industrial. Option NVME PCIe 128GB 3D FerriSSD, I-temp, TLC mode; Option with PCIE packet switch; Option LVDS Industrial temp range; Option TPM SLB 9670 Q2.0 (CFG A0) - Ind; Option LPC.
Intel® Core™ i5-13600HRE Raptor Lake H 45W, 12 (4P+8E) cores (80 EU, 18M Cache, up to 4.80 GHz, vPro, IBECC, IND), BGA1744 - Industrial. Option no NVME (PEG 1x8 + 1x4 + 1x4); Option with PCIE packet switch; Option LVDS Industrial temp range; Option TPM SLB 9670 Q2.0 (CFG A0) - Ind; Option LPC.
Intel® Core™ i5-13600HE Raptor Lake H 45W, 12 (4P+8E) cores (80 EU, 18M Cache, up to 4.80 GHz, vPro, EMB), BGA1744 - Embedded Bro. Option NVME PCIe 128GB 3D FerriSSD, C-temp, TLC mode; Option with PCIE packet switch; Option eDP; Option TPM SLB 9670 Q2.0 (CFG A0) - Comm; Option LPC.
Intel® Core™ i3-1320PE Raptor Lake P 28W, 8 (4P+4E) cores (48 EU, 12M Cache, up to 4.50 GHz, EMB), BGA1744 - Embedded Broad Market. Option no NVME (PEG 1x8 + 1x4 + 1x4); Option with PCIE packet switch; Option eDP; Option TPM SLB 9670 Q2.0 (CFG A0) - Comm; Option LPC.
CPU Intel® Celeron® 7305E Alder Lake P 15W 5(1P+4E) core (48EU, 8M Cache, 1.00 GHz, No IPU) FC-BGA16FnOption no NVME (PEG 1x8 + 1x4 + 1x4)nOption with no PCIE switchnOption eDPnOption VGAnOption TPM SLB 9670 Q2.0 (CFG A0) - CommnOption LPC
Optional Intel® Core™ i7-1365URE Raptor Lake U 15W, 10 (2P+8E) cores (96 EU, 12M Cache, up to 4.90 GHz, vPro, IBECC, IND), BGA1744. Option NVME PCIe 128GB 3D FerriSSD, I-temp, TLC mode; Option with PCIE packet switch; Option LVDS Industrial temp range; Option TPM SLB 9670 Q2.0 (CFG A0) - Ind; Option LPC.
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