DE
EN - € 
ES 
FR 
IT 
JP 
USA 
ZH 
Produktbeschreibung
Beschreibung
|
"Highly integrated modules and boards offer very high performance within small dimensions. On the other hand, the miniaturization of ICs and the high operating frequencies of the processors lead to high heat generation that must be dissipated in order to maintain the CPU within its allowed temperature range. The operating temperature specified in the Technical Features of the module/board indicates the temperature range in which any and all parts of the heat spreader / heat sink must remain, in order for SECO to guarantee functionality. Hence, these numbers do not necessarily indicate the suitable environmental temperature. The heat spreader is not intended to be a guaranteed standalone cooling system, but should be used only as a supplemental means of transferring heat to another dissipation system (i.e. heat sinks, fans, heat pipes etc). It is the customer’s responsibility to design and apply an application-dependent cooling system, capable of ensuring that the heat spreader / heat sink temperature remain within the indicated range of the module. It is an absolute requirement that customers, after thorough evaluation of the processor’s workload in the actual system application, the system enclosure and consequent air flow/Thermal analysis, accurately study and develop a suitable cooling solution for the assembled system." |
|---|
| QC25-DISS-1-PK | Beschreibung Teilenummer Q7-C25 Heat spreader - Packaged |
Sie haben nicht die Lösung gefunden, nach der Sie gesucht haben?
Das Standardprodukt erfüllt nicht Ihre Anforderungen? SECO bietet Ihnen die Möglichkeit, gemeinsam mit Ihnen eine teilweise oder komplett kundenspezifisch angepasste Hardware- und Softwarelösung zu entwickeln.
Mehr erfahren
