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  1. Mass Storage
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Cpu Maker
  1. NXP 1 item
  2. Qualcomm 1 item
Cpu Type
  1. NXP i.MX8 1 item
  2. Qualcomm® QCS5430 1 item
Ethernet
  1. ETHERNET≥1 2 items
  2. ETHERNET≥2 1 item
Form Factor
  1. SMARC 1 item
  2. Modular HMIs 1 item
Form Factor Dimensions
  1. ≤ 100 x 100mm 1 item
  2. ≥ 100 x 100mm 1 item
Form Factor Specification
  1. Other SBCs 1 item
InstallationDepth
  1. 35-40 1 item
Memory
  1. memory ≤1 2 items
  2. memory ≤2 1 item
  3. memory ≤4 1 item
  4. memory ≤8 1 item
  5. soldered down 1 item
Mass Storage
  1. onboard SSD 1 item
  2. soldered down 1 item
  3. M.2 NVMe SSD slot 1 item
  4. M.2 SATA SSD slot 3 items
  5. microSD card slot 3 items
  6. onboard eMMC 7 items
  7. onboard eMMC 2 items
  8. SATA channels ≥ 1 7 items
  9. SATA channels ≥ 2 1 item
  10. SATA channels ≥ 2 1 item
  11. SATA channels ≥ 2 2 items
  12. SD interface 3 items
  13. SD interface 3 items
  14. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 2 items
Operating Temperature
  1. -20°C ÷ +60°C 1 item
  2. 0°C ÷ +50°C 2 items
  3. 0°C ÷ +60°C 2 items
  4. 20°C ÷ +70°C 1 item
  5. -20°C ÷ +70°C 1 item
Pci Express
  1. PCI-e lanes ≥ 1 1 item
  2. PCI-e lanes ≥ 2 1 item
ScreenDimension
  1. 1 item
Ttl Uarts
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  2. TTL Uarts ≥2 1 item
USB
  1. USB 2.0 ≥ 1 2 items
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  3. USB 2.0 ≥ 3 2 items
  4. USB 2.0 ≥ 4 1 item
  5. USB 3.1 ≥ 1 1 item
  6. USB OTG 1 item
Video Interfaces
  1. DP 4 items
  2. DP++ 3 items
  3. DUAL CHANNEL LVDS 7 items
  4. eDP 5 items
  5. HDMI 11 items
  6. MIPI-CSI camera conn 2 items
  7. MIPI-DSI 2 items
  8. SINGLE CHANNEL LVDS 6 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 1 item
Unsere Produkte
  • Computer on Module
  • Single Board Computer
  • Human Machine Interface
  • Lüfterlose Embedded PCs
  • Industrielle Embedded PCs
  • Payment Systems
  • Entwicklungskits & Zubehör
  • AI-Optimized Hardware
  • TFT Display
  • Modular Vision
  • Dev Kits, Carrier Boards and Accessories
  • Evaluation Kit
  • Single Board Computer
  • Touch Display Solution