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  1. Cpu Maker
    Qualcomm
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    ETHERNET≥1
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Cpu Maker
  1. AMD 10 items
  2. Arm System ready NXP 1 item
  3. Intel 35 items
  4. MediaTek 7 items
  5. NVIDIA 1 item
  6. NXP 34 items
  7. Qualcomm 8 items
  8. Rockchip 4 items
Cpu Power Consumption
  1. range < 5 W 1 item
Cpu Type
  1. Qualcomm Snapdragon 1 item
  2. Qualcomm® QCS5430 1 item
  3. Qualcomm® QCS6490 3 items
  4. Qualcomm Dragonwing IQ-2390 1 item
  5. Qualcomm Dragonwing 1 item
  6. Qualcomm Dragonwing IQ-2390 1 item
Ethernet
  1. ETHERNET≥1 8 items
  2. ETHERNET≥2 6 items
Form Factor
  1. COM Express® 1 item
  2. Myon MicroModule SOM 1 item
  3. SMARC 2 items
  4. Modular HMIs 2 items
  5. Single Board Computer 2 items
Form Factor Dimensions
  1. 48,5 x 32,5 mm 1 item
  2. ≤ 100 x 100mm 2 items
  3. ≥ 100 x 100mm 1 item
  4. COM Express® 1 item
Form Factor Specification
  1. COM Express Compact 1 item
Memory
  1. memory ≤1 3 items
  2. memory ≤2 3 items
  3. memory ≤4 4 items
  4. memory ≤8 2 items
  5. soldered down 4 items
  6. UFS 3.1 module on-board 1 item
  7. I2C EEPROM 1 item
Mounting Option
  1. VESA Mount 2 items
  2. Rear Mount 2 items
  3. Panel Mount 2 items
  4. Flush Mount 2 items
Mass Storage
  1. soldered down 1 item
  2. microSD card slot 2 items
  3. onboard eMMC 1 item
  4. onboard eMMC 6 items
  5. SD interface 4 items
  6. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 2 items
  2. -40°C ÷ +85°C 1 item
  3. 0°C ÷ +50°C 2 items
  4. 0°C ÷ +60°C 7 items
  5. 20°C ÷ +70°C 2 items
  6. -20°C ÷ +70°C 2 items
Pci Express
  1. PCI-e lanes ≥ 1 2 items
  2. PCI-e lanes ≥ 2 2 items
  3. PCI-e lanes ≥ 5 1 item
Ttl Uarts
  1. TTL Uarts ≥1 4 items
  2. TTL Uarts ≥2 3 items
USB
  1. USB 2.0 ≥ 1 4 items
  2. USB 2.0 ≥ 2 2 items
  3. USB 2.0 ≥ 3 2 items
  4. USB 2.0 ≥ 4 2 items
  5. USB 2.0 ≥ 6 1 item
  6. USB 3.0 ≥ 1 1 item
  7. USB 3.0 ≥ 4 1 item
  8. USB 3.1 ≥ 1 2 items
  9. USB 3.2 ≥ 1 2 items
  10. USB CLIENT 1 item
  11. USB OTG 1 item
Video Interfaces
  1. DP 3 items
  2. DUAL CHANNEL LVDS 3 items
  3. eDP 3 items
  4. MIPI-CSI camera conn 2 items
  5. MIPI-DSI 5 items
  6. SINGLE CHANNEL LVDS 1 item
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 2 items
  2. ONBOARD WI-FI/BLE 2 items
Unsere Produkte
  • Computer on Module
  • Single Board Computer
  • Human Machine Interface
  • Lüfterlose Embedded PCs
  • Industrielle Embedded PCs
  • Payment Systems
  • Entwicklungskits & Zubehör
  • AI-Optimized Hardware
  • Evaluation Kit
  • Touch Display Solutions