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Palladio 500 RPL AI

Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics

SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H). (F36)

UDOO x86 II

UDOO x86 II

SBC based on Intel® Celeron® and Pentium® Applications Processor

UDOO VISION

UDOO VISION

Pico-ITX Single Board Computer with the Intel® Atom® X Series, Intel® Celeron® N Series and Intel® Pentium® N Series (codename: Apollo Lake) Processors

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

不带风扇的嵌入式计算机，配备第11代英特尔® Core™和英特尔® Celeron® SoCs（代号：Tiger Lake UP3）以及Axelera AI芯片：由单个Metis AIPU提供动力，最高可达120 TOPS

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  1. Memory
    memory ≤8
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Cpu Power Consumption
  1. range < 10 W 1 item
Cpu Type
  1. Intel® Atom™ 2 items
  2. Intel® Celeron® 1 item
  3. Intel® Pentium® 1 item
Ethernet
  1. ETHERNET≥1 1 item
  2. ETHERNET≥2 2 items
Form Factor
  1. Boxed Solutions 1 item
Form Factor Dimensions
  1. ≥ 100 x 100mm 1 item
Memory
  1. memory ≤1 1 item
  2. memory ≤16 2 items
  3. memory ≤2 2 items
  4. memory ≤4 1 item
  5. memory ≤8 2 items
  6. soldered down 2 items
Mass Storage
  1. onboard SSD 3 items
  2. standard SATA connector 4 items
  3. CFAST slot 1 item
  4. M.2 NVMe SSD slot 2 items
  5. M.2 SATA SSD slot 11 items
  6. microSD card slot 6 items
  7. onboard eMMC 2 items
  8. onboard eMMC 15 items
  9. onboard eMMC 2 items
  10. SATA channels ≥ 1 22 items
  11. SATA channels ≥ 2 16 items
  12. SATA channels ≥ 3 6 items
  13. SATA channels ≥ 4 4 items
  14. SD interface 4 items
USB
  1. USB 3.0 ≥ 1 2 items
  2. USB 3.0 ≥ 2 1 item
Video Interfaces
  1. DP 1 item
  2. DP++ 2 items
  3. HDMI 1 item
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 1 item
  2. M.2 Socket 2 key B 1 item
  3. ONBOARD WI-FI/BLE 1 item