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Palladio 500 RPL AI

Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics

SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H)

UDOO x86 II

UDOO x86 II

SBC based on Intel® Celeron® and Pentium® Applications Processor

UDOO VISION

UDOO VISION

Pico-ITX Single Board Computer with the Intel® Atom® X Series, Intel® Celeron® N Series and Intel® Pentium® N Series (codename: Apollo Lake) Processors

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

不带风扇的嵌入式计算机，配备第11代英特尔® Core™和英特尔® Celeron® SoCs（代号：Tiger Lake UP3）以及Axelera AI芯片：由单个Metis AIPU提供动力，最高可达120 TOPS

Intel 处理器

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  1. Form Factor Specification
    Qseven 70x70 mm
  2. USB
    USB 3.0 ≥ 2
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Cpu Power Consumption
  1. range 10-25 W 1 item
  2. range < 10 W 1 item
Cpu Type
  1. Intel® Atom™ 1 item
  2. Intel® Celeron® 1 item
  3. Intel® Pentium® 1 item
Form Factor Dimensions
  1. ≤ 100 x 100mm 1 item
  2. ≤ 80 x 80mm 1 item
Form Factor Specification
  1. COM Express Basic 3 items
  2. COM Express Compact 5 items
  3. embedded NUC 1 item
  4. Pico-ITX 2 items
  5. Qseven 70x70 mm 1 item
Memory
  1. memory ≤1 1 item
  2. memory ≤2 1 item
  3. memory ≤4 1 item
  4. memory ≤8 1 item
  5. soldered down 1 item
Mass Storage
  1. onboard eMMC 1 item
  2. SATA channels ≥ 1 1 item
  3. SATA channels ≥ 2 1 item
  4. SD interface 1 item
Operating Temperature
  1. -40°C ÷ +85°C 1 item
  2. 0°C ÷ +50°C 1 item
  3. 0°C ÷ +60°C 1 item
  4. 20°C ÷ +70°C 1 item
Pci Express
  1. PCI-e lanes ≥ 1 1 item
  2. PCI-e lanes ≥ 2 1 item
  3. PCI-e lanes ≥ 3 1 item
  4. PCI-e lanes ≥ 4 1 item
USB
  1. USB 2.0 ≥ 1 3 items
  2. USB 2.0 ≥ 2 3 items
  3. USB 2.0 ≥ 3 3 items
  4. USB 2.0 ≥ 4 3 items
  5. USB 2.0 ≥ 5 3 items
  6. USB 2.0 ≥ 6 4 items
  7. USB 3.0 ≥ 1 3 items
  8. USB 3.0 ≥ 2 1 item
  9. USB 3.2 ≥ 2 1 item
Video Interfaces
  1. DP++ 1 item
  2. DUAL CHANNEL LVDS 1 item
  3. eDP 1 item
  4. HDMI 1 item
  5. SINGLE CHANNEL LVDS 1 item