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COM Express®
COM-HPC®
Qseven®
SMARC®
Myon MicroModule (SOM)
Trizeps SODIMM (SOM)
ETX®

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  1. Ttl Uarts
    TTL Uarts ≥3
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Cpu Maker
  1. AMD 1 item
  2. Intel 1 item
  3. MediaTek 2 items
  4. NXP 9 items
  5. Qualcomm 1 item
Cpu Power Consumption
  1. range 10-25 W 2 items
  2. range < 10 W 3 items
  3. range < 5 W 5 items
Cpu Type
  1. Intel® Atom™ 1 item
  2. Intel® Celeron® 1 item
  3. Intel® Pentium® 1 item
  4. MediaTek Genio 510 1 item
  5. MediaTek Genio 700 1 item
  6. NXP i.MX 8M 2 items
  7. NXP i.MX 8M Mini 2 items
  8. NXP i.MX 8M Nano 1 item
  9. NXP i.MX 8M Plus 1 item
  10. NXP i.MX 8X 1 item
  11. NXP i.MX 933/935 1 item
  12. NXP i.MX 95 1 item
  13. NXP i.MX6 1 item
  14. Zynq® Ultras 1 item
  15. Qualcomm® Dragonwing IQ-8 1 item
Ethernet
  1. ETHERNET≥1 12 items
  2. ETHERNET≥2 7 items
Form Factor
  1. Myon MicroModule SOM 1 item
  2. SMARC 9 items
  3. Trizeps SODIMM SOM 4 items
Form Factor Dimensions
  1. 48,5 x 32,5 mm 1 item
  2. 67,6 x 36,7 mm 4 items
  3. ≤ 100 x 100mm 8 items
  4. ≤ 80 x 80mm 5 items
Memory
  1. memory ≤1 12 items
  2. memory ≤16 1 item
  3. memory ≤2 13 items
  4. memory ≤4 11 items
  5. memory ≤8 9 items
  6. soldered down 8 items
  7. memory ≤32 1 item
Mass Storage
  1. onboard eMMC 11 items
  2. onboard eMMC 2 items
  3. SATA channels ≥ 1 2 items
  4. SD interface 5 items
  5. SD interface 2 items
  6. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 7 items
  2. -20°C ÷ +70°C 1 item
  3. -40°C ÷ +85°C 14 items
  4. 0°C ÷ +50°C 7 items
  5. 0°C ÷ +60°C 9 items
  6. 20°C ÷ +70°C 6 items
  7. -20°C ÷ +70°C 2 items
Pci Express
  1. PCI-e lanes ≥ 1 6 items
  2. PCI-e lanes ≥ 2 4 items
  3. PCI-e lanes ≥ 3 2 items
  4. PCI-e lanes ≥ 4 3 items
Ttl Uarts
  1. TTL Uarts ≥1 37 items
  2. TTL Uarts ≥2 41 items
  3. TTL Uarts ≥3 14 items
USB
  1. USB 2.0 ≥ 1 10 items
  2. USB 2.0 ≥ 2 9 items
  3. USB 2.0 ≥ 3 6 items
  4. USB 2.0 ≥ 4 5 items
  5. USB 2.0 ≥ 5 5 items
  6. USB 2.0 ≥ 6 2 items
  7. USB 3.0 ≥ 1 6 items
  8. USB 3.0 ≥ 2 7 items
  9. USB 3.1 ≥ 1 2 items
  10. USB OTG 6 items
Video Interfaces
  1. DP 3 items
  2. DP++ 1 item
  3. DUAL CHANNEL LVDS 8 items
  4. eDP 3 items
  5. HDMI 5 items
  6. MIPI-CSI camera conn 3 items
  7. MIPI-DSI 9 items
  8. PARALLEL RGB 3 items
  9. SINGLE CHANNEL LVDS 9 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 2 items
  2. ONBOARD WI-FI/BLE 4 items
模块
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®