Menu
Account
模块
COM Express®
COM-HPC®
Qseven®
SMARC®
Myon MicroModule (SOM)
Trizeps SODIMM (SOM)
ETX®

模块

Shop By
Clear All

Items 7-12 of 27

Set Descending Direction
Page
per page
Shop By
现在购物由
  1. Pci Express
    PCI-e lanes ≥ 4
Clear All
Shopping Options
Cpu Maker
  1. AMD 5 items
  2. Intel 20 items
  3. Qualcomm 1 item
  4. Rockchip 1 item
Cpu Power Consumption
  1. range 10-25 W 14 items
  2. range < 10 W 8 items
  3. range > 25 W 6 items
Cpu Type
  1. AMD EPYC™ Embedded 3 1 item
  2. AMD Ryzen™ Embedded 2 items
  3. AMD® Ryzen™ embedded 1 item
  4. Intel® Atom™ 11 items
  5. Intel® Celeron® 10 items
  6. Intel® Core™ 12 items
  7. Intel® Pentium® 7 items
  8. Intel® Xeon® 2 items
  9. Rockchip RK3588 1 item
  10. Zynq® Ultras 1 item
  11. Qualcomm® Dragonwing IQ-8 1 item
Ethernet
  1. ETHERNET≥1 23 items
  2. ETHERNET≥2 9 items
Form Factor
  1. COM Express® 16 items
  2. COM-HPC® 2 items
  3. Qseven 2 items
  4. SMARC 7 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
  2. ≤ 100 x 100mm 17 items
  3. ≤ 80 x 80mm 6 items
  4. ≥ 100 x 100mm 4 items
  5. COM Express® 1 item
Form Factor Specification
  1. COM Express Basic 5 items
  2. COM Express Compact 11 items
  3. COM-HPC Client 2 items
  4. Qseven 70x70 mm 2 items
Memory
  1. memory ≤1 20 items
  2. memory ≤16 17 items
  3. memory ≤2 20 items
  4. memory ≤4 21 items
  5. memory ≤8 21 items
  6. memory ≥32 13 items
  7. soldered down 10 items
  8. SO_DIMM 15 items
  9. memory ≤32 1 item
Mass Storage
  1. CFAST slot 1 item
  2. M.2 NVMe SSD slot 2 items
  3. microSD card slot 3 items
  4. onboard eMMC 16 items
  5. SATA channels ≥ 1 24 items
  6. SATA channels ≥ 2 17 items
  7. SATA channels ≥ 2 1 item
  8. SATA channels ≥ 3 3 items
  9. SATA channels ≥ 4 1 item
  10. SD interface 6 items
  11. SD interface 1 item
  12. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 13 items
  2. -20°C ÷ +70°C 2 items
  3. -40°C ÷ +85°C 20 items
  4. 0°C ÷ +50°C 17 items
  5. 0°C ÷ +60°C 24 items
  6. 20°C ÷ +70°C 12 items
  7. -20°C ÷ +70°C 3 items
Pci Express
  1. PCI-e lanes ≥ 1 39 items
  2. PCI-e lanes ≥ 2 31 items
  3. PCI-e lanes ≥ 3 25 items
  4. PCI-e lanes ≥ 4 27 items
  5. PCI-e lanes ≥ 5 21 items
Ttl Uarts
  1. TTL Uarts ≥1 20 items
  2. TTL Uarts ≥2 21 items
  3. TTL Uarts ≥3 3 items
USB
  1. USB 2.0 ≥ 1 21 items
  2. USB 2.0 ≥ 2 20 items
  3. USB 2.0 ≥ 3 20 items
  4. USB 2.0 ≥ 4 19 items
  5. USB 2.0 ≥ 5 20 items
  6. USB 2.0 ≥ 6 22 items
  7. USB 3.0 ≥ 1 13 items
  8. USB 3.0 ≥ 2 14 items
  9. USB 3.0 ≥ 3 10 items
  10. USB 3.0 ≥ 4 6 items
  11. USB 3.1 ≥ 1 8 items
  12. USB 3.1 ≥ 2 8 items
  13. USB 3.2 ≥ 1 4 items
  14. USB 3.2 ≥ 2 6 items
  15. USB 4.0 ≥ 1 1 item
  16. USB 4.0 ≥ 2 1 item
  17. USB CLIENT 2 items
  18. USB OTG 2 items
Video Interfaces
  1. DDI 13 items
  2. DP 16 items
  3. DP++ 10 items
  4. DUAL CHANNEL LVDS 18 items
  5. eDP 23 items
  6. HDMI 19 items
  7. MIPI-CSI camera conn 6 items
  8. MIPI-DSI 2 items
  9. PARALLEL RGB 1 item
  10. SINGLE CHANNEL LVDS 17 items
  11. VGA 4 items
模块
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®