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COM Express®
COM-HPC®
Qseven®
SMARC®
Myon MicroModule (SOM)
Trizeps SODIMM (SOM)
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现在购物由
  1. Operating Temperature
    -40°C ÷ +85°C
  2. Video Interfaces
    SINGLE CHANNEL LVDS
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Shopping Options
Cpu Maker
  1. AMD 4 items
  2. Intel 9 items
  3. NXP 11 items
  4. Qualcomm 2 items
Cpu Power Consumption
  1. range 10-25 W 8 items
  2. range < 10 W 10 items
  3. range < 5 W 3 items
  4. range > 25 W 5 items
Cpu Type
  1. AMD Ryzen™ Embedded 2 items
  2. AMD® Ryzen™ embedded 1 item
  3. Intel® Atom™ 6 items
  4. Intel® Celeron® 4 items
  5. Intel® Core™ 5 items
  6. Intel® Pentium® 5 items
  7. NXP i.MX 8M 2 items
  8. NXP i.MX 8M Mini 2 items
  9. NXP i.MX 8M Nano 1 item
  10. NXP i.MX 8M Plus 2 items
  11. NXP i.MX 8X 1 item
  12. NXP i.MX 933/935 1 item
  13. NXP i.MX6 2 items
  14. NXP i.MX8 1 item
  15. Zynq® Ultras 1 item
  16. Qualcomm Dragonwing 1 item
  17. Qualcomm® Dragonwing IQ-8 1 item
Ethernet
  1. ETHERNET≥1 22 items
  2. ETHERNET≥2 7 items
Form Factor
  1. COM Express® 11 items
  2. Myon MicroModule SOM 1 item
  3. Qseven 5 items
  4. SMARC 7 items
  5. Trizeps SODIMM SOM 2 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
  2. 48,5 x 32,5 mm 1 item
  3. 67,6 x 36,7 mm 2 items
  4. ≤ 100 x 100mm 17 items
  5. ≤ 80 x 80mm 10 items
  6. ≥ 100 x 100mm 2 items
  7. COM Express® 2 items
Form Factor Specification
  1. COM Express Basic 2 items
  2. COM Express Compact 9 items
  3. Qseven 70x70 mm 4 items
  4. µQseven 70x40 1 item
InstallationDepth
  1. memory ≤4 1 item
  2. memory ≤1 1 item
  3. memory ≤2 1 item
  4. soldered down 1 item
Memory
  1. memory ≤1 21 items
  2. memory ≤16 7 items
  3. memory ≤2 21 items
  4. memory ≤4 20 items
  5. memory ≤8 14 items
  6. memory ≥32 6 items
  7. soldered down 14 items
  8. SO_DIMM 10 items
  9. memory ≤32 1 item
  10. UFS 3.1 module on-board 1 item
  11. I2C EEPROM 1 item
Mass Storage
  1. onboard SSD 1 item
  2. soldered down 1 item
  3. CFAST slot 1 item
  4. M.2 NVMe SSD slot 1 item
  5. microSD card slot 3 items
  6. onboard eMMC 19 items
  7. SATA channels ≥ 1 14 items
  8. SATA channels ≥ 2 2 items
  9. SATA channels ≥ 2 9 items
  10. SATA channels ≥ 3 1 item
  11. SD interface 10 items
  12. SD interface 1 item
  13. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 2 items
Operating Temperature
  1. -20°C ÷ +60°C 16 items
  2. -20°C ÷ +70°C 1 item
  3. -40°C ÷ +85°C 26 items
  4. 0°C ÷ +50°C 20 items
  5. 0°C ÷ +60°C 27 items
  6. 20°C ÷ +70°C 17 items
  7. -20°C ÷ +70°C 3 items
Pci Express
  1. PCI-e lanes ≥ 1 19 items
  2. PCI-e lanes ≥ 2 14 items
  3. PCI-e lanes ≥ 3 12 items
  4. PCI-e lanes ≥ 4 13 items
  5. PCI-e lanes ≥ 5 10 items
ScreenDimension
  1. TTL Uarts ≥1 1 item
Ttl Uarts
  1. TTL Uarts ≥1 21 items
  2. TTL Uarts ≥2 20 items
  3. TTL Uarts ≥3 9 items
USB
  1. USB 2.0 ≥ 1 20 items
  2. USB 2.0 ≥ 2 20 items
  3. USB 2.0 ≥ 3 16 items
  4. USB 2.0 ≥ 4 15 items
  5. USB 2.0 ≥ 5 12 items
  6. USB 2.0 ≥ 6 12 items
  7. USB 3.0 ≥ 1 16 items
  8. USB 3.0 ≥ 2 15 items
  9. USB 3.0 ≥ 3 7 items
  10. USB 3.0 ≥ 4 4 items
  11. USB 3.1 ≥ 1 4 items
  12. USB 3.1 ≥ 2 4 items
  13. USB 3.2 ≥ 1 1 item
  14. USB 3.2 ≥ 2 2 items
  15. USB 4.0 ≥ 2 1 item
  16. USB CLIENT 1 item
  17. USB OTG 10 items
Video Interfaces
  1. DDI 10 items
  2. DP 16 items
  3. DP++ 9 items
  4. DUAL CHANNEL LVDS 27 items
  5. eDP 23 items
  6. HDMI 27 items
  7. MIPI-CSI camera conn 6 items
  8. MIPI-DSI 10 items
  9. PARALLEL RGB 4 items
  10. SINGLE CHANNEL LVDS 26 items
  11. VGA 3 items
Wireless Connectivity
  1. ONBOARD WI-FI/BLE 5 items
  2. /Q/7/Q7-C26_70x70mm_1000x1000px_15_1.jpg 1 item
模块
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®