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SMARC®
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Trizeps SODIMM (SOM)
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  1. Mass Storage
    SD interface
  2. Video Interfaces
    DP
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Cpu Maker
  1. AMD 1 item
  2. Intel 1 item
  3. NXP 1 item
Cpu Power Consumption
  1. range 10-25 W 2 items
  2. range < 10 W 2 items
  3. range > 25 W 1 item
Cpu Type
  1. Intel® Celeron® 1 item
  2. Intel® Core™ 1 item
  3. Intel® Xeon® 1 item
  4. NXP i.MX8 1 item
  5. Zynq® Ultras 1 item
Ethernet
  1. ETHERNET≥1 3 items
  2. ETHERNET≥2 1 item
Form Factor
  1. COM Express® 1 item
  2. Qseven 1 item
  3. SMARC 1 item
Form Factor Dimensions
  1. ≤ 100 x 100mm 2 items
  2. ≤ 80 x 80mm 2 items
  3. ≥ 100 x 100mm 1 item
Form Factor Specification
  1. COM Express Basic 1 item
  2. Qseven 70x70 mm 1 item
InstallationDepth
  1. memory ≤4 1 item
  2. memory ≤1 1 item
  3. memory ≤2 1 item
  4. soldered down 1 item
Memory
  1. memory ≤1 3 items
  2. memory ≤16 1 item
  3. memory ≤2 3 items
  4. memory ≤4 3 items
  5. memory ≤8 2 items
  6. memory ≥32 1 item
  7. soldered down 2 items
  8. SO_DIMM 1 item
Mass Storage
  1. soldered down 1 item
  2. M.2 NVMe SSD slot 3 items
  3. microSD card slot 4 items
  4. onboard eMMC 10 items
  5. onboard eMMC 3 items
  6. SATA channels ≥ 1 14 items
  7. SATA channels ≥ 1 1 item
  8. SATA channels ≥ 2 3 items
  9. SATA channels ≥ 2 10 items
  10. SATA channels ≥ 3 2 items
  11. SATA channels ≥ 4 1 item
  12. SD interface 3 items
  13. SD interface 3 items
  14. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 2 items
Operating Temperature
  1. -20°C ÷ +60°C 2 items
  2. -40°C ÷ +85°C 2 items
  3. 0°C ÷ +50°C 3 items
  4. 0°C ÷ +60°C 3 items
  5. 20°C ÷ +70°C 2 items
Pci Express
  1. PCI-e lanes ≥ 1 3 items
  2. PCI-e lanes ≥ 2 3 items
  3. PCI-e lanes ≥ 3 2 items
  4. PCI-e lanes ≥ 4 2 items
  5. PCI-e lanes ≥ 5 1 item
ScreenDimension
  1. TTL Uarts ≥1 1 item
Ttl Uarts
  1. TTL Uarts ≥1 3 items
  2. TTL Uarts ≥2 2 items
  3. TTL Uarts ≥3 1 item
USB
  1. USB 2.0 ≥ 1 3 items
  2. USB 2.0 ≥ 2 3 items
  3. USB 2.0 ≥ 3 3 items
  4. USB 2.0 ≥ 4 2 items
  5. USB 2.0 ≥ 5 1 item
  6. USB 2.0 ≥ 6 1 item
  7. USB 3.0 ≥ 1 3 items
  8. USB 3.0 ≥ 2 2 items
  9. USB 3.0 ≥ 3 1 item
  10. USB 3.0 ≥ 4 1 item
  11. USB OTG 2 items
Video Interfaces
  1. DDI 1 item
  2. DP 3 items
  3. DP++ 3 items
  4. DUAL CHANNEL LVDS 12 items
  5. eDP 6 items
  6. HDMI 10 items
  7. MIPI-CSI camera conn 3 items
  8. MIPI-DSI 4 items
  9. SINGLE CHANNEL LVDS 12 items
  10. VGA 1 item
Wireless Connectivity
  1. /Q/7/Q7-C26_70x70mm_1000x1000px_15_1.jpg 1 item
模块
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®