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(简体): 开发套件与配件
(简体): 配件
(简体): 载板
(简体): 开发套件与入门套件

(简体): 开发套件与配件

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Cpu Maker
  1. Intel 1 item
  2. Qualcomm 1 item
Cpu Power Consumption
  1. range 10-25 W 1 item
  2. range < 10 W 1 item
  3. range < 5 W 1 item
  4. range > 25 W 2 items
Cpu Type
  1. Intel® Xeon® 1 item
  2. Qualcomm® QCS6490 1 item
Ethernet
  1. ETHERNET≥1 2 items
  2. ETHERNET≥2 5 items
Form Factor
  1. COM-HPC® 1 item
  2. SMARC 3 items
  3. Trizeps SODIMM SOM 1 item
Form Factor Dimensions
  1. ≤ 80 x 80mm 1 item
  2. ≥ 100 x 100mm 2 items
Form Factor Specification
  1. COM-HPC Client 1 item
Memory
  1. soldered down 1 item
Mass Storage
  1. M.2 SATA SSD slot 2 items
  2. microSD card slot 2 items
  3. onboard eMMC 1 item
  4. SATA channels ≥ 1 1 item
  5. SATA channels ≥ 2 1 item
  6. SD interface 1 item
  7. SD interface 1 item
Operating Temperature
  1. -40°C ÷ +85°C 4 items
  2. 0°C ÷ +50°C 1 item
  3. 0°C ÷ +60°C 2 items
  4. -20°C ÷ +70°C 1 item
Pci Express
  1. PCI-e lanes ≥ 1 2 items
  2. PCI-e lanes ≥ 2 2 items
  3. PCI-e lanes ≥ 3 2 items
  4. PCI-e lanes ≥ 4 3 items
  5. PCI-e lanes ≥ 5 2 items
Ttl Uarts
  1. TTL Uarts ≥3 1 item
USB
  1. USB 2.0 ≥ 1 7 items
  2. USB 2.0 ≥ 2 2 items
  3. USB 2.0 ≥ 3 2 items
  4. USB 2.0 ≥ 4 4 items
  5. USB 2.0 ≥ 5 2 items
  6. USB 2.0 ≥ 6 1 item
  7. USB 3.0 ≥ 1 2 items
  8. USB 3.0 ≥ 2 1 item
  9. USB 3.1 ≥ 1 2 items
  10. USB 3.1 ≥ 2 1 item
  11. USB 4.0 ≥ 1 1 item
  12. USB 4.0 ≥ 2 1 item
  13. USB 4.0 ≥ 3 1 item
  14. USB 4.0 ≥ 4 2 items
  15. USB CLIENT 1 item
  16. USB OTG 5 items
Video Interfaces
  1. DP 2 items
  2. DP++ 3 items
  3. DUAL CHANNEL LVDS 3 items
  4. eDP 1 item
  5. HDMI 3 items
  6. MIPI-CSI camera conn 2 items
  7. MIPI-DSI 1 item
  8. PARALLEL RGB 1 item
  9. SINGLE CHANNEL LVDS 2 items
Wireless Connectivity
  1. ONBOARD WI-FI/BLE 2 items
(简体): 开发套件与配件
  • (简体): 配件
  • (简体): 载板
  • (简体): 开发套件与入门套件