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SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H). (F36)

UDOO x86 II

UDOO x86 II

SBC based on Intel® Celeron® and Pentium® Applications Processor

UDOO VISION

UDOO VISION

Pico-ITX Single Board Computer with the Intel® Atom® X Series, Intel® Celeron® N Series and Intel® Pentium® N Series (codename: Apollo Lake) Processors

UDOO BOLT GEAR

UDOO BOLT GEAR

Boxed solution based on AMD Embedded Ryzen V1605B Applications Processor

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

不带风扇的嵌入式计算机，配备第11代英特尔® Core™和英特尔® Celeron® SoCs（代号：Tiger Lake UP3）以及Axelera AI芯片：由单个Metis AIPU提供动力，最高可达120 TOPS

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  1. ETHERNET≥2 1 item
Form Factor
  1. Boxed Solutions 1 item
  2. Modular HMIs 1 item
  3. Single Board Computer 2 items
Form Factor Dimensions
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Form Factor Specification
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Memory
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  2. memory ≤2 1 item
  3. soldered down 2 items
Mass Storage
  1. onboard SSD 2 items
  2. standard SATA connector 3 items
  3. M.2 SATA SSD slot 6 items
  4. microSD card slot 1 item
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  6. onboard eMMC 2 items
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  8. SATA channels ≥ 1 1 item
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  3. USB OTG 1 item
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  3. HDMI 1 item
Wireless Connectivity
  1. M.2 Socket 2 key B 1 item