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SOM-SMARC-Dragonwing-IQ8

SOM-SMARC-Dragonwing-IQ8

SMARC® Rel. 2.1.1 module with Qualcomm Dragonwing™ IQ8 Applications Processors. (F86)

/images/trizeps/som-trizeps-x-genio-front-main.jpg

SOM-Trizeps-X-Genio360

SODIMM-200 CPU Computer on Module with MediaTek Genio 360 Applications Processor. (F67)

/images/hmi/modular-vision-front-main-10-1.jpg

Modular Vision 10.1 MX95

Entry level 10.1 inch HMI based on NXP i.MX95

/images/com_express/SOM-COMe-CT6-Dragonwing-X_front.jpg

SOM-COMe-CT6-Dragonwing-IQ-X

COM Express 3.1 Type 6 Compact modules with Qualcomm Dragonwing IQ-X Series of processors in SiP-A, featuring a Qualcomm Hexagon NPU with up to 45 TOPS. (F31)

Titan 225 RK3399

Titan 225 RK3399

Fanless Embedded Computer based on Rockchip RK3399 Applications Processor. (PICTOR - SYS-C31-IPC)

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  7. Raspberry Pi 1 item
Cpu Type
  1. MediaTek Genio 510 1 item
  2. MediaTek Genio 700 1 item
  3. MediaTek Genio360 1 item
Ethernet
  1. ETHERNET≥1 3 items
  2. ETHERNET≥2 1 item
Form Factor
  1. SMARC 2 items
  2. Trizeps SODIMM SOM 1 item
Form Factor Dimensions
  1. 67,6 x 36,7 mm 1 item
  2. ≤ 100 x 100mm 2 items
Memory
  1. memory ≤1 3 items
  2. memory ≤2 3 items
  3. memory ≤4 3 items
  4. memory ≤8 2 items
  5. soldered down 2 items
Mass Storage
  1. onboard eMMC 1 item
  2. onboard eMMC 1 item
  3. onboard eMMC 1 item
Operating Temperature
  1. -20°C ÷ +60°C 2 items
  2. -20°C ÷ +70°C 1 item
  3. -40°C ÷ +85°C 3 items
  4. 0°C ÷ +50°C 2 items
  5. 0°C ÷ +60°C 2 items
  6. 20°C ÷ +70°C 1 item
  7. -20°C ÷ +70°C 1 item
Ttl Uarts
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  2. TTL Uarts ≥2 3 items
  3. TTL Uarts ≥3 3 items
USB
  1. USB 2.0 ≥ 1 2 items
  2. USB 2.0 ≥ 2 2 items
  3. USB 2.0 ≥ 3 2 items
  4. USB 2.0 ≥ 4 2 items
  5. USB 2.0 ≥ 5 2 items
  6. USB 3.0 ≥ 1 1 item
  7. USB 3.0 ≥ 2 1 item
  8. USB 3.1 ≥ 1 2 items
Video Interfaces
  1. DP 1 item
  2. DUAL CHANNEL LVDS 1 item
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  5. MIPI-DSI 1 item
  6. PARALLEL RGB 1 item
  7. SINGLE CHANNEL LVDS 1 item
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 1 item
  2. ONBOARD WI-FI/BLE 1 item