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USA 我们的产品
面向最具创新性项目的一系列广泛的 SECO 产品：模块、单板计算机、无风扇嵌入式计算机、HMI 和智能边缘计算解决方案，以及载板、入门套件和所有能有助完成您的项目的配件。
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SOM-SMARC-ASL符合SMARC® Rel 2.1标准的模块，采用用于Edge应用的Intel Atom® x7000RE系列处理器 -
SOM-COMe-CT6-ASL采用Intel Atom® x7000E系列处理器（代号：Amston Lake和Alder Lake N）的COM Express® 3.1 Type 6紧凑型模块 -
SOM-SMARC-MX95SMARC® Rel. 2.1.1 module with NXP i.MX 95 Applications Processors -
SOM-COM-HPC-A-TGL-UP3COM-HPC® Client Computer on Module (CoM) Size A with 11th Gen Intel® Core™ and Celeron® (Codename: Tiger Lake-UP3) Processors. (CARINA - C77) -
SBC-eNUC-APLembedded NUC™ SBC with the Intel® Atom™ X Series, Intel® Celeron® J / N Series and Intel® Pentium® N Series (codename: Apollo Lake) Processors. (ALVIN - B68) -
SBC-3.5-MX83.5" SBC with NXP i.MX8 Applications Processors. (THEMIS - C43) -
DEV-KIT-COM-HPC-ACross Platform Development Kit compatible with both x86 and ARM COM-HPC Client modules -
SOM-SMARC-EHLSMARC® Rel. 2.1.1 Computer on Module (CoM) with Intel® Atom® x6000E Series and Intel® Pentium® and Celeron® N and J Series (Codename: Elkhart Lake) Processors for FuSa applications. (HALLEY - C93) -
SOM-COM-HPC-A-TGL-HCOM-HPC® Client Computer on Module (CoM) Size A with 11th Gen Intel® Xeon® W-11000E Series, Core™ vPro® and Celeron® (Codename: Tiger Lake-H) Processors for FuSa applications. (LAGOON - D57) -
SOM-COMe-BT6-SKL/KLCOM Express® Basic Type 6 Computer on Module (CoM) with Intel® 6th and 7th generation Core™ / Xeon® (Codename: Skylake and Kaby Lake) CPUs. (TARVOS - B09)
