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Cpu Maker
  1. Arm System ready NXP 1 item
  2. Intel 7 items
  3. NXP 3 items
  4. Qualcomm 3 items
Cpu Power Consumption
  1. range 10-25 W 2 items
  2. range < 10 W 4 items
Cpu Type
  1. Intel® Atom™ 3 items
  2. Intel® Celeron® 1 item
  3. Intel® Core™ 5 items
  4. Intel® Pentium® 1 item
  5. NXP i.MX 8M 1 item
  6. NXP i.MX 8M Mini 1 item
  7. NXP i.MX6 1 item
  8. NXP i.MX8 1 item
  9. Qualcomm® QCS5430 1 item
  10. Qualcomm Dragonwing 1 item
  11. Qualcomm® Dragonwing IQ-8 1 item
Ethernet
  1. ETHERNET≥1 12 items
  2. ETHERNET≥2 9 items
Form Factor
  1. COM Express® 4 items
  2. Qseven 1 item
  3. SMARC 8 items
  4. Modular HMIs 1 item
  5. Single Board Computer 1 item
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 2 items
  2. ≤ 100 x 100mm 7 items
  3. ≤ 80 x 80mm 4 items
  4. ≥ 100 x 100mm 3 items
  5. COM Express® 2 items
Form Factor Specification
  1. 3,5" 1 item
  2. COM Express Basic 3 items
  3. COM Express Compact 1 item
  4. Other SBCs 1 item
  5. Qseven 70x70 mm 1 item
InstallationDepth
  1. 35-40 1 item
Memory
  1. memory ≤1 8 items
  2. memory ≤16 3 items
  3. memory ≤2 7 items
  4. memory ≤4 7 items
  5. memory ≤8 4 items
  6. memory ≥32 4 items
  7. soldered down 10 items
  8. SO_DIMM 1 item
  9. memory ≤32 1 item
  10. UFS 3.1 module on-board 1 item
  11. I2C EEPROM 1 item
Mass Storage
  1. onboard SSD 1 item
  2. soldered down 1 item
  3. M.2 NVMe SSD slot 1 item
  4. M.2 SATA SSD slot 3 items
  5. microSD card slot 3 items
  6. onboard eMMC 7 items
  7. onboard eMMC 2 items
  8. SATA channels ≥ 1 7 items
  9. SATA channels ≥ 2 1 item
  10. SATA channels ≥ 2 1 item
  11. SATA channels ≥ 2 2 items
  12. SD interface 3 items
  13. SD interface 3 items
  14. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 2 items
Operating Temperature
  1. -20°C ÷ +60°C 5 items
  2. -40°C ÷ +85°C 9 items
  3. 0°C ÷ +50°C 7 items
  4. 0°C ÷ +60°C 13 items
  5. 20°C ÷ +70°C 5 items
  6. -20°C ÷ +70°C 1 item
Pci Express
  1. PCI-e lanes ≥ 1 7 items
  2. PCI-e lanes ≥ 2 6 items
  3. PCI-e lanes ≥ 3 4 items
  4. PCI-e lanes ≥ 4 7 items
  5. PCI-e lanes ≥ 5 5 items
ScreenDimension
  1. 1 item
Ttl Uarts
  1. TTL Uarts ≥1 7 items
  2. TTL Uarts ≥2 9 items
  3. TTL Uarts ≥3 4 items
USB
  1. USB 2.0 ≥ 1 10 items
  2. USB 2.0 ≥ 2 9 items
  3. USB 2.0 ≥ 3 8 items
  4. USB 2.0 ≥ 4 7 items
  5. USB 2.0 ≥ 5 4 items
  6. USB 2.0 ≥ 6 6 items
  7. USB 3.0 ≥ 1 3 items
  8. USB 3.0 ≥ 2 5 items
  9. USB 3.0 ≥ 3 1 item
  10. USB 3.0 ≥ 4 2 items
  11. USB 3.1 ≥ 1 1 item
  12. USB 3.2 ≥ 1 1 item
  13. USB 3.2 ≥ 2 2 items
  14. USB 4.0 ≥ 1 1 item
  15. USB 4.0 ≥ 2 3 items
  16. USB 4.0 ≥ 3 1 item
  17. USB 4.0 ≥ 4 1 item
  18. USB OTG 7 items
Video Interfaces
  1. DDI 19 items
  2. DP 35 items
  3. DP++ 32 items
  4. DUAL CHANNEL LVDS 56 items
  5. eDP 52 items
  6. HDMI 67 items
  7. MIPI-CSI camera conn 16 items
  8. MIPI-DSI 16 items
  9. PARALLEL RGB 7 items
  10. SINGLE CHANNEL LVDS 52 items
  11. VGA 5 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 1 item
  2. ONBOARD WI-FI/BLE 2 items
我们的产品
  • 模块
  • SBC
  • HMI 解决方案
  • 无风扇嵌入式计算机
  • 嵌入式计算机
  • 支付系统
  • (简体): 开发套件与配件
  • 人工智能优化硬件
  • TFT Display
  • Modular Vision
  • Dev Kits, Carrier Boards and Accessories
  • Evaluation Kit
  • Single Board Computer
  • Touch Display Solution