
我们的产品
Shop By
-
SBC-3.5-TGL-UP3SBC 3.5” con processori Intel® Core™ e Celeron® di undicesima generazione (codename: Tiger Lake-UP3). (PRISMA - D64)Intel 处理器 SBC 3.5-inch SBC -
SBC-3.5-RV10003.5” SBC with AMD Ryzen™ Embedded R1000 / V1000 family of SOCs. (MERIDA - C90)SBC 3.5-inch SBC -
M.2 Axelera AIPUM.2 AI Edge accelerator card powered by a quad-core METIS AIPU(简体): 开发套件与配件 (简体): 配件 Other Accessories Dev Kits, Carrier Boards and Accessories Accessories Other Accessories -
HD57-DISS-3-PKCOM HPC TIGER LAKE H I7 Heat sink (ACTIVE) - Packaged(简体): 开发套件与配件 (简体): 配件 Heat Spreaders Dev Kits, Carrier Boards and Accessories Accessories Heat Spreaders -
DEV-KIT-COM-HPC-ACross Platform Development Kit compatible with both x86 and ARM COM-HPC Client modules(简体): 开发套件与配件 (简体): 开发套件与入门套件 COM-HPC Development Kit Dev Kits, Carrier Boards and Accessories Starter and Development Kits COM-HPC Development Kit
![DELTA [Discontinued]](https://edge.seco.com/media/catalog/product/cache/a5b745a475b3b98286ea46a3a3ad8c65/_/q/_q_7_q7-922_1_3.jpg)