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  1. Mass Storage
    SATA channels ≥ 2
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Cpu Maker
  1. AMD 4 items
  2. Intel 18 items
Cpu Power Consumption
  1. range 10-25 W 9 items
  2. range < 10 W 4 items
  3. range > 25 W 6 items
Cpu Type
  1. AMD EPYC™ Embedded 3 1 item
  2. AMD Ryzen™ Embedded 2 items
  3. AMD® Ryzen™ embedded 2 items
  4. Intel® Atom™ 6 items
  5. Intel® Celeron® 6 items
  6. Intel® Core™ 14 items
  7. Intel® Pentium® 5 items
  8. Intel® Xeon® 1 item
Ethernet
  1. ETHERNET≥1 20 items
  2. ETHERNET≥2 7 items
Form Factor
  1. COM Express® 14 items
  2. COM-HPC® 2 items
  3. Qseven 2 items
  4. Boxed Solutions 3 items
  5. Single Board Computer 1 item
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
  2. ≤ 100 x 100mm 9 items
  3. ≤ 80 x 80mm 2 items
  4. ≥ 100 x 100mm 5 items
  5. COM Express® 1 item
Form Factor Specification
  1. 3,5" 1 item
  2. COM Express Basic 5 items
  3. COM Express Compact 9 items
  4. COM-HPC Client 2 items
  5. Qseven 70x70 mm 2 items
Memory
  1. memory ≤1 19 items
  2. memory ≤16 18 items
  3. memory ≤2 19 items
  4. memory ≤4 20 items
  5. memory ≤8 20 items
  6. memory ≥32 16 items
  7. soldered down 3 items
  8. SO_DIMM 18 items
Mass Storage
  1. mSATA half-size slot 1 item
  2. onboard SSD 4 items
  3. standard SATA connector 9 items
  4. soldered down 1 item
  5. CFAST slot 2 items
  6. I2C EEPROM 1 item
  7. M.2 NVMe SSD slot 11 items
  8. M.2 SATA SSD slot 25 items
  9. microSD card slot 33 items
  10. onboard eMMC 5 items
  11. onboard eMMC 50 items
  12. onboard eMMC 31 items
  13. SATA channels ≥ 1 39 items
  14. SATA channels ≥ 1 3 items
  15. SATA channels ≥ 2 1 item
  16. SATA channels ≥ 2 8 items
  17. SATA channels ≥ 2 22 items
  18. SATA channels ≥ 3 7 items
  19. SATA channels ≥ 4 5 items
  20. SD interface 17 items
  21. SD interface 22 items
  22. UFS 4.0 module on-board, optional, up to 1 TB microSD card slot 1 item
  23. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 2 items
Operating Temperature
  1. -20°C ÷ +60°C 13 items
  2. -20°C ÷ +70°C 4 items
  3. -40°C ÷ +85°C 14 items
  4. 0°C ÷ +50°C 18 items
  5. 0°C ÷ +60°C 20 items
  6. 20°C ÷ +70°C 13 items
  7. -20°C ÷ +70°C 4 items
Pci Express
  1. PCI-e lanes ≥ 1 18 items
  2. PCI-e lanes ≥ 2 18 items
  3. PCI-e lanes ≥ 3 16 items
  4. PCI-e lanes ≥ 4 17 items
  5. PCI-e lanes ≥ 5 16 items
Ttl Uarts
  1. TTL Uarts ≥1 14 items
  2. TTL Uarts ≥2 14 items
USB
  1. USB 2.0 ≥ 1 15 items
  2. USB 2.0 ≥ 2 15 items
  3. USB 2.0 ≥ 3 15 items
  4. USB 2.0 ≥ 4 15 items
  5. USB 2.0 ≥ 5 14 items
  6. USB 2.0 ≥ 6 14 items
  7. USB 3.0 ≥ 1 11 items
  8. USB 3.0 ≥ 2 11 items
  9. USB 3.0 ≥ 3 10 items
  10. USB 3.0 ≥ 4 5 items
  11. USB 3.1 ≥ 1 7 items
  12. USB 3.1 ≥ 2 7 items
  13. USB 3.2 ≥ 1 5 items
  14. USB 3.2 ≥ 2 7 items
  15. USB 4.0 ≥ 2 1 item
  16. USB 4.0 ≥ 4 1 item
  17. USB CLIENT 1 item
  18. USB OTG 2 items
Video Interfaces
  1. DDI 13 items
  2. DP 13 items
  3. DP++ 5 items
  4. DUAL CHANNEL LVDS 12 items
  5. eDP 17 items
  6. HDMI 14 items
  7. MIPI-CSI camera conn 2 items
  8. PARALLEL RGB 1 item
  9. SINGLE CHANNEL LVDS 12 items
  10. VGA 4 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 4 items
  2. M.2 SOCKET 2 KEY 1 item
  3. ONBOARD WI-FI/BLE 1 item
我们的产品
  • 模块
  • SBC
  • HMI 解决方案
  • 无风扇嵌入式计算机
  • 嵌入式计算机
  • 支付系统
  • (简体): 开发套件与配件
  • 人工智能优化硬件
  • TFT Display
  • Modular Vision
  • Dev Kits, Carrier Boards and Accessories
  • Evaluation Kit
  • Single Board Computer
  • Touch Display Solution