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Cpu Maker
  1. AMD 4 items
  2. Arm System ready NXP 1 item
  3. Intel 26 items
  4. MediaTek 1 item
  5. NXP 11 items
  6. Qualcomm 7 items
  7. Rockchip 3 items
Cpu Power Consumption
  1. range 10-25 W 12 items
  2. range < 10 W 14 items
  3. range < 5 W 2 items
  4. range > 25 W 4 items
Cpu Type
  1. AMD EPYC™ Embedded 3 1 item
  2. AMD Ryzen™ Embedded 1 item
  3. AMD® G-Series™ 1 item
  4. AMD® R-Series 1 item
  5. AMD® Ryzen™ embedded 1 item
  6. Intel® Atom™ 14 items
  7. Intel® Celeron® 12 items
  8. Intel® Core™ 12 items
  9. Intel® Pentium® 8 items
  10. NXP i.MX 8M Mini 1 item
  11. NXP i.MX 8M Plus 2 items
  12. NXP i.MX 8X 2 items
  13. NXP i.MX 93 2 items
  14. NXP i.MX 933/935 1 item
  15. NXP i.MX 95 1 item
  16. NXP i.MX6 1 item
  17. NXP i.MX8 1 item
  18. Qualcomm® QCS5430 1 item
  19. Qualcomm® QCS6490 2 items
  20. Rockchip RK3399 2 items
  21. Rockchip RK3568 1 item
  22. Zynq® Ultras 1 item
  23. Qualcomm Dragonwing IQ-X 1 item
  24. MediaTek Genio360 1 item
  25. Qualcomm Dragonwing IQ9 1 item
  26. NXP i.MX 952 1 item
Ethernet
  1. ETHERNET≥1 103 items
  2. ETHERNET≥2 58 items
Form Factor
  1. COM Express® 2 items
  2. COM-HPC® 6 items
  3. SMARC 17 items
  4. Trizeps SODIMM SOM 3 items
  5. Boxed Solutions 13 items
  6. Single Board Computer 14 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
  2. 67,6 x 36,7 mm 2 items
  3. ≤ 100 x 100mm 16 items
  4. ≤ 80 x 80mm 8 items
  5. ≥ 100 x 100mm 14 items
  6. COM Express® 1 item
Form Factor Specification
  1. 3,5" 7 items
  2. COM Express Basic 1 item
  3. COM-HPC Client 4 items
  4. embedded NUC 1 item
  5. Other SBCs 1 item
  6. Pico-ITX 4 items
  7. ≤ 100 x 100mm 1 item
  8. ≥ 100 x 100mm 1 item
Memory
  1. memory ≤1 35 items
  2. memory ≤16 16 items
  3. memory ≤2 36 items
  4. memory ≤4 34 items
  5. memory ≤8 26 items
  6. memory ≥32 11 items
  7. soldered down 28 items
  8. SO_DIMM 13 items
  9. memory ≤32 1 item
  10. I2C EEPROM 1 item
  11. UFS 4.0 module on-board, optional, up to 256GB microSD card slot 1 item
Mass Storage
  1. onboard SSD 3 items
  2. standard SATA connector 5 items
  3. CFAST slot 1 item
  4. I2C EEPROM 1 item
  5. M.2 NVMe SSD slot 7 items
  6. M.2 SATA SSD slot 18 items
  7. microSD card slot 10 items
  8. onboard eMMC 22 items
  9. onboard eMMC 12 items
  10. SATA channels ≥ 1 18 items
  11. SATA channels ≥ 1 2 items
  12. SATA channels ≥ 2 3 items
  13. SATA channels ≥ 2 8 items
  14. SATA channels ≥ 3 3 items
  15. SATA channels ≥ 4 3 items
  16. SD interface 6 items
  17. SD interface 7 items
  18. UFS 4.0 module on-board, optional, up to 1 TB microSD card slot 1 item
  19. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 21 items
  2. -20°C ÷ +70°C 2 items
  3. -40°C ÷ +85°C 30 items
  4. 0°C ÷ +50°C 32 items
  5. 0°C ÷ +60°C 41 items
  6. 20°C ÷ +70°C 20 items
  7. -20°C ÷ +70°C 6 items
  8. -20°C ÷ +70°C 1 item
  9. -40°C ÷ +60°C 1 item
Pci Express
  1. PCI-e lanes ≥ 1 20 items
  2. PCI-e lanes ≥ 2 17 items
  3. PCI-e lanes ≥ 3 9 items
  4. PCI-e lanes ≥ 4 13 items
  5. PCI-e lanes ≥ 5 8 items
  6. 0°C ÷ +50°C 1 item
  7. 0°C ÷ +60°C 1 item
ScreenDimension
  1. RS232 1 item
Ttl Uarts
  1. TTL Uarts ≥1 19 items
  2. TTL Uarts ≥2 25 items
  3. TTL Uarts ≥3 13 items
USB
  1. USB 2.0 ≥ 1 31 items
  2. USB 2.0 ≥ 2 28 items
  3. USB 2.0 ≥ 3 20 items
  4. USB 2.0 ≥ 4 19 items
  5. USB 2.0 ≥ 5 9 items
  6. USB 2.0 ≥ 6 8 items
  7. USB 3.0 ≥ 1 19 items
  8. USB 3.0 ≥ 2 17 items
  9. USB 3.0 ≥ 3 3 items
  10. USB 3.0 ≥ 4 1 item
  11. USB 3.1 ≥ 1 8 items
  12. USB 3.1 ≥ 2 3 items
  13. USB 3.2 ≥ 1 7 items
  14. USB 3.2 ≥ 2 10 items
  15. USB 4.0 ≥ 1 2 items
  16. USB 4.0 ≥ 2 2 items
  17. USB 4.0 ≥ 3 2 items
  18. USB 4.0 ≥ 4 4 items
  19. USB CLIENT 1 item
  20. USB OTG 16 items
Video Interfaces
  1. DDI 4 items
  2. DP 17 items
  3. DP++ 23 items
  4. DUAL CHANNEL LVDS 21 items
  5. eDP 25 items
  6. HDMI 27 items
  7. MIPI-CSI camera conn 11 items
  8. MIPI-DSI 11 items
  9. PARALLEL RGB 3 items
  10. SINGLE CHANNEL LVDS 22 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 17 items
  2. M.2 SOCKET 2 KEY 9 items
  3. M.2 Socket 2 key B 10 items
  4. ONBOARD WI-FI/BLE 17 items
  5. /s/n/snapdragon-x_per_sito.jpg 1 item
我们的产品
  • 模块
  • SBC
  • HMI 解决方案
  • 无风扇嵌入式计算机
  • 嵌入式计算机
  • 支付系统
  • (简体): 开发套件与配件
  • 人工智能优化硬件
  • Evaluation Kit
  • Touch Display Solutions