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SOM-COMe-CT6-Dragonwing-IQ9COM Express® 3.1 Type 6 Compact Module with Qualcomm Dragonwing™ IQ9 Processors. (F99)模块 COM Express® Qualcomm 处理器 COM Express® -
SOM-COMe-CT6-P100COM Express® 3.1 Type 6 Compact Module with AMD Ryzen™ AI Embedded P100 Series. (F45)COM Express® -
SOM-COMe-CT6-ASLCOM Express® 3.1 Type 6 Compact Module with Intel Atom® Processors x7000RE Series (Codename: Amston Lake). (E90)x86 COM Express® Intel 处理器 -
SBC-3.5-RV10003.5” SBC with AMD Ryzen™ Embedded R1000 / V1000 family of SOCs. (MERIDA - C90)SBC 3.5-inch SBC -
HD57-DISS-3-PKCOM HPC TIGER LAKE H I7 Heat sink (ACTIVE) - Packaged(简体): 开发套件与配件 (简体): 配件 Heat Spreaders Dev Kits, Carrier Boards and Accessories Accessories Heat Spreaders -
DEV-KIT-COM-HPC-ACross Platform Development Kit compatible with both x86 and ARM COM-HPC Client modules(简体): 开发套件与配件 (简体): 开发套件与入门套件 COM-HPC Development Kit Dev Kits, Carrier Boards and Accessories Starter and Development Kits COM-HPC Development Kit