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  1. Ethernet
    ETHERNET≥1
  2. Memory
    soldered down
  3. Mass Storage
    onboard eMMC
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Cpu Maker
  1. AMD 1 item
  2. Arm System ready NXP 1 item
  3. Intel 9 items
  4. MediaTek 1 item
  5. NVIDIA 1 item
  6. NXP 11 items
  7. Rockchip 3 items
Cpu Power Consumption
  1. range 10-25 W 7 items
  2. range < 10 W 21 items
Cpu Type
  1. Intel® Atom™ 8 items
  2. Intel® Celeron® 7 items
  3. Intel® Pentium® 7 items
  4. MediaTek Genio 510 1 item
  5. NVIDIA Tegra® T30 1 item
  6. NXP i.MX 8M 4 items
  7. NXP i.MX 8M Mini 2 items
  8. NXP i.MX 8M Nano 1 item
  9. NXP i.MX 8X 1 item
  10. NXP i.MX 933/935 1 item
  11. NXP i.MX6 2 items
  12. NXP i.MX8 2 items
  13. Rockchip RK3399 2 items
  14. Rockchip RK3568 1 item
  15. Zynq® Ultras 1 item
Ethernet
  1. ETHERNET≥1 27 items
  2. ETHERNET≥2 21 items
Form Factor
  1. Qseven 8 items
  2. SMARC 7 items
  3. Boxed Solutions 4 items
  4. Single Board Computer 8 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
  2. 40x70 mm (µQseven, 1.57"x 2.76") 1 item
  3. ≤ 100 x 100mm 13 items
  4. ≤ 80 x 80mm 12 items
  5. ≥ 100 x 100mm 10 items
Form Factor Specification
  1. 3,5" 6 items
  2. embedded NUC 1 item
  3. Pico-ITX 1 item
  4. Qseven 70x70 mm 6 items
  5. µQseven 70x40 2 items
InstallationDepth
  1. memory ≤4 1 item
  2. memory ≤1 1 item
  3. memory ≤2 1 item
  4. soldered down 1 item
Memory
  1. memory ≤1 40 items
  2. memory ≤16 9 items
  3. memory ≤2 40 items
  4. memory ≤4 33 items
  5. memory ≤8 23 items
  6. memory ≥32 2 items
  7. soldered down 27 items
  8. SO_DIMM 6 items
Mass Storage
  1. mSATA half-size slot 1 item
  2. onboard SSD 4 items
  3. standard SATA connector 4 items
  4. soldered down 1 item
  5. M.2 SATA SSD slot 7 items
  6. microSD card slot 12 items
  7. onboard eMMC 2 items
  8. onboard eMMC 27 items
  9. onboard eMMC 10 items
  10. SATA channels ≥ 1 13 items
  11. SATA channels ≥ 2 2 items
  12. SD interface 11 items
  13. SD interface 7 items
  14. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 17 items
  2. -20°C ÷ +70°C 1 item
  3. -40°C ÷ +85°C 19 items
  4. 0°C ÷ +50°C 23 items
  5. 0°C ÷ +60°C 24 items
  6. 20°C ÷ +70°C 17 items
Pci Express
  1. PCI-e lanes ≥ 1 15 items
  2. PCI-e lanes ≥ 2 10 items
  3. PCI-e lanes ≥ 3 7 items
  4. PCI-e lanes ≥ 4 7 items
ScreenDimension
  1. TTL Uarts ≥1 1 item
Ttl Uarts
  1. TTL Uarts ≥1 18 items
  2. TTL Uarts ≥2 16 items
  3. TTL Uarts ≥3 8 items
USB
  1. USB 2.0 ≥ 1 23 items
  2. USB 2.0 ≥ 2 23 items
  3. USB 2.0 ≥ 3 17 items
  4. USB 2.0 ≥ 4 16 items
  5. USB 2.0 ≥ 5 10 items
  6. USB 2.0 ≥ 6 6 items
  7. USB 3.0 ≥ 1 14 items
  8. USB 3.0 ≥ 2 8 items
  9. USB 3.0 ≥ 3 1 item
  10. USB 3.1 ≥ 1 2 items
  11. USB 3.1 ≥ 2 1 item
  12. USB 3.2 ≥ 1 1 item
  13. USB 3.2 ≥ 2 3 items
  14. USB OTG 10 items
Video Interfaces
  1. DP 8 items
  2. DP++ 9 items
  3. DUAL CHANNEL LVDS 19 items
  4. eDP 15 items
  5. HDMI 16 items
  6. MIPI-CSI camera conn 5 items
  7. MIPI-DSI 3 items
  8. SINGLE CHANNEL LVDS 17 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 4 items
  2. M.2 SOCKET 2 KEY 6 items
  3. M.2 Socket 2 key B 4 items
  4. ONBOARD WI-FI/BLE 11 items
  5. /Q/7/Q7-C26_70x70mm_1000x1000px_15_1.jpg 1 item
我们的产品
  • 模块
  • SBC
  • HMI 解决方案
  • 无风扇嵌入式计算机
  • 嵌入式计算机
  • 支付系统
  • (简体): 开发套件与配件
  • 人工智能优化硬件
  • TFT Display
  • Modular Vision
  • Dev Kits, Carrier Boards and Accessories
  • Evaluation Kit
  • Single Board Computer
  • Touch Display Solution