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Cpu Maker
  1. AMD 4 items
  2. Arm System ready NXP 1 item
  3. Intel 26 items
  4. MediaTek 1 item
  5. NXP 11 items
  6. Qualcomm 7 items
  7. Rockchip 3 items
Cpu Power Consumption
  1. range 10-25 W 1 item
  2. range < 10 W 1 item
  3. range < 5 W 1 item
  4. range > 25 W 1 item
Cpu Type
  1. NXP i.MX 93 1 item
  2. Qualcomm® QCS5430 1 item
  3. Qualcomm® QCS6490 2 items
  4. Qualcomm Dragonwing IQ-X 1 item
  5. Qualcomm Dragonwing IQ9 1 item
Ethernet
  1. ETHERNET≥1 8 items
  2. ETHERNET≥2 7 items
Form Factor
  1. COM Express® 1 item
  2. COM-HPC® 1 item
  3. SMARC 4 items
  4. Boxed Solutions 1 item
Form Factor Dimensions
  1. ≤ 100 x 100mm 3 items
  2. ≥ 100 x 100mm 1 item
  3. COM Express® 1 item
Memory
  1. memory ≤1 2 items
  2. memory ≤2 2 items
  3. memory ≤4 3 items
  4. memory ≤8 2 items
  5. soldered down 5 items
  6. memory ≤32 1 item
  7. I2C EEPROM 1 item
  8. UFS 4.0 module on-board, optional, up to 256GB microSD card slot 1 item
Mass Storage
  1. I2C EEPROM 1 item
  2. M.2 NVMe SSD slot 1 item
  3. onboard eMMC 1 item
  4. onboard eMMC 3 items
  5. SATA channels ≥ 2 1 item
  6. SD interface 1 item
  7. SD interface 3 items
  8. UFS 4.0 module on-board, optional, up to 1 TB microSD card slot 1 item
  9. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 3 items
  2. -40°C ÷ +85°C 3 items
  3. 0°C ÷ +50°C 3 items
  4. 0°C ÷ +60°C 6 items
  5. 20°C ÷ +70°C 2 items
  6. -20°C ÷ +70°C 2 items
  7. -40°C ÷ +60°C 1 item
Pci Express
  1. PCI-e lanes ≥ 1 2 items
  2. PCI-e lanes ≥ 2 2 items
  3. PCI-e lanes ≥ 4 1 item
  4. PCI-e lanes ≥ 5 1 item
Ttl Uarts
  1. TTL Uarts ≥1 2 items
  2. TTL Uarts ≥2 3 items
  3. TTL Uarts ≥3 2 items
USB
  1. USB 2.0 ≥ 1 3 items
  2. USB 2.0 ≥ 2 2 items
  3. USB 2.0 ≥ 3 2 items
  4. USB 2.0 ≥ 4 3 items
  5. USB 2.0 ≥ 5 1 item
  6. USB 3.0 ≥ 2 1 item
  7. USB 3.1 ≥ 1 4 items
  8. USB CLIENT 1 item
Video Interfaces
  1. DDI 1 item
  2. DP 5 items
  3. DUAL CHANNEL LVDS 3 items
  4. eDP 3 items
  5. HDMI 1 item
  6. MIPI-CSI camera conn 3 items
  7. MIPI-DSI 3 items
  8. SINGLE CHANNEL LVDS 2 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 2 items
  2. ONBOARD WI-FI/BLE 2 items
  3. /s/n/snapdragon-x_per_sito.jpg 1 item
我们的产品
  • 模块
  • SBC
  • HMI 解决方案
  • 无风扇嵌入式计算机
  • 嵌入式计算机
  • 支付系统
  • (简体): 开发套件与配件
  • 人工智能优化硬件
  • Evaluation Kit
  • Touch Display Solutions