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面向最具创新性项目的一系列广泛的 SECO 产品:模块、单板计算机、无风扇嵌入式计算机、HMI 和智能边缘计算解决方案,以及载板、入门套件和所有能有助完成您的项目的配件。

8 项目

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  1. SOM-COMe-CT6-ASL
    SOM-COMe-CT6-ASL
    采用Intel Atom® x7000E系列处理器(代号:Amston Lake和Alder Lake N)的COM Express® 3.1 Type 6紧凑型模块
  2. SOM-COM-HPC-A-TGL-UP3
    SOM-COM-HPC-A-TGL-UP3
    COM-HPC® Client Computer on Module (CoM) Size A with 11th Gen Intel® Core™ and Celeron® (Codename: Tiger Lake-UP3) Processors. (CARINA - C77)
  3. SOM-COM-HPC-A-RPL
    SOM-COM-HPC-A-RPL
    COM-HPC® Client module Size A, with 13th Gen Intel® Core™ processors (Codename: Raptor Lake – H/P/U series). (ORION - D80)
  4. SBC-3.5-TGL-UP3
    SBC-3.5-TGL-UP3
    SBC 3.5” con processori Intel® Core™ e Celeron® di undicesima generazione (codename: Tiger Lake-UP3). (PRISMA - D64)
  5.  SOM-COM-HPC-A-TGL-H
    SOM-COM-HPC-A-TGL-H
    COM-HPC® Client Computer on Module (CoM) Size A with 11th Gen Intel® Xeon® W-11000E Series, Core™ vPro® and Celeron® (Codename: Tiger Lake-H) Processors for FuSa applications. (LAGOON - D57)
  6. SOM-COMe-BT6-SKL/KL
    SOM-COMe-BT6-SKL/KL
    COM Express® Basic Type 6 Computer on Module (CoM) with Intel® 6th and 7th generation Core™ / Xeon® (Codename: Skylake and Kaby Lake) CPUs. (TARVOS - B09)
  7. SOM-COMe-CT6-TGL-U
    SOM-COMe-CT6-TGL-U
    COM Express® Rel. 3.0 Compact Type 6 Computer on Module (CoM) with 11th Gen Intel® Core™ (Codename: Tiger Lake UP3) Processors. (CALYPSO - D40)
  8. SOM-COMe-BT6-RPL-P
    SOM-COMe-BT6-RPL-P
    COM Express® 3.1 Type 6 Basic Computer on Module (CoM) with 13th Gen Intel® Core™ processors (Codename: Raptor Lake-P). (CALLISTO - E03)

8 项目

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