USA
DE 
EN - € 
ES 
FR 
IT 
JP 
ZH 
COM Express®
For high-end design and markets
High graphic processing capabilities
Rich functionality
For high-performance projects
2 formats: Basic (4.92 x 3.74 in) and Compact (3. 74 x 3.74 in)
Advantages of the Computer-on-Module Approach
Design investment limited to the carrier board
Consolidated standards
Scalable and future-proof solutions
Long-term availability
ARM and x86 compatibility
Multi-vendor solutions
Highly configurable
Innovative and updatable solutions
Reduced time-to-market
Description
The COM Express® standard lets you customize your projects quickly and cost-effectively. SECO modules are available in COM Express® Type 6 and Type 7, in two formats: “Basic”, with dimensions of 4.92 x 3.74 in, suited to highly energy-sensitive devices, and “Compact”, 3.74 x 3.74 in, a good compromise between high performance and reduced size.
COM Express® Interfaces
-
SOM-COMe-CT6-R1000COM Express® Rel. 3.0 Compact Type 6 Computer on Module (CoM) with AMD Ryzen™ Embedded R1000 family of SoCs. (METIS - C89) -
SOM-COMe-BT7-E3000COM Express® Rel.3.0 Basic Type 7 Computer on Module (CoM) with the AMD EPYC™ Embedded 3000 Series of SoCs. (THEBE - C42) -
SOM-COMe-CT6-V1000COM Express® Rel. 3.0 Compact Type 6 Computer on Module (CoM) with AMD Ryzen™ Embedded V1000 Processors. (CHARON - B75) -
SOM-COMe-BT6-SKL/KLCOM Express® Basic Type 6 Computer on Module (CoM) with Intel® 6th and 7th generation Core™ / Xeon® (Codename: Skylake and Kaby Lake) CPUs. (TARVOS - B09)
