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Fanless Embedded Computers
Off-The-Shelf Solutions
Experience in assembly services and mechanical design
Cloud-agnostic
Multi-protocol industrial Ethernet support
Ideal for Industrial IoT applications
System integration-ready solutions
Possibilities Offered by SECO
Heat dissipation solutions - both passive and active via a fan – also for the newest CPUs, with the aid of heat pipe systems where necessary.
Manufacturing of plastic components with injection molding
Production of aluminum mechanical parts with extrusion technology
Design of mechanical parts with die-casting technology
Bending and pressing of sheet metal parts
Development of personalized wiring to manage the connection of all parts of systems containing one or more boards/displays, etc.
Description
Thanks to our experience in integrating modules and boards into complex systems, SECO has created “off-the-shelf” solutions based on its own ARM and x86 SBCs, all available in our catalog. SECO Fanless Embedded Computers have been developed for applications in Industrial IoT with the goal of satisfying the need for flexibility and security.
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Titan 300 TGL-UP3 AIFanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (Codename: Tiger Lake UP3) plus Axelera AI Chip: Powered by a single Metis AIPU up to 120 TOPS -
Titan 235 APLFanless Embedded Computer with Intel® Atom™ X Series (codename: Apollo Lake) Processors. (CYGNUS - SYS-B68-IPC) -
Titan 230 APLFanless Embedded Computer with Intel® Celeron® J / N Series and Intel® Pentium® N Series (codename: Apollo Lake) Processors. (HYDRUS - SYS-B68-IGW)
