AI-Optimized Hardware
Description
Products optimized for artificial intelligence with specialized accelerators such as TPUs and NPUs.
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SOM-COM-HPC-A-RPLCOM-HPC® Client module Size A, with 13th Gen Intel® Core™ processors (Codename: Raptor Lake – H/P/U series). (ORION - D80)
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Titan 300 TGL-UP3 AIFanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (Codename: Tiger Lake UP3) plus Axelera AI Chip: Powered by a single Metis AIPU up to 120 TOPS
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SOM-COM-HPC-A-TGL-HCOM-HPC® Client Computer on Module (CoM) Size A with 11th Gen Intel® Xeon® W-11000E Series, Core™ vPro® and Celeron® (Codename: Tiger Lake-H) Processors for FuSa applications. (LAGOON - D57)