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SECO’s wide range of products for the most innovative projects: Modules, Single-Board Computers, Fanless Embedded Computers, HMIs and solutions for Smart Edge Computing, as well as Carrier Boards, Starter Kits, and all the accessories to complete your project.

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  1. MC08-DISS-1-PK
    MC08-DISS-1-PK
    COM Express Type 6 - COMe-B08-BT6 Heat Spreader (PASSIVE) Packaged
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  2. Q962-DISS-1-I-PK
    Q962-DISS-1-I-PK
    Q7 HEAT SPREADER: µQ7-962 Heat Spreader (PASSIVE) for Dual & Quad (AUTOMOTIVE & INDUSTRIAL) Packaged
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  3. MB75-DISS-3-PK
    MB75-DISS-3-PK
    COM EXP HEAT SINK ACTIVE: COM Express Type 6 - COMe-B75-CT6 Heat Sink (ACTIVE)
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  4. Q962-DISS-2-C-PK
    Q962-DISS-2-C-PK
    Q7 HEAT SINK: µQ7-962 Heat Sink (PASSIVE) for COMMERCIAL VERSION and Solo & DualLite INDUSTRIAL Packaged
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  5. RB71-DISS-1-PK
    RB71-DISS-1-PK
    SMARC HEAT SPREADER: SM-B71 Heat Spreader (PASSIVE) - Packaged
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  6. MB75-DISS-1-PK
    MB75-DISS-1-PK
    COM Express Type 6 - COMe-B75-CT6 Heat Spreader (PASSIVE) - Packaged
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  7. VA13
    VA13
    USB-to-Serial port converter modules
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  8. RB69-DISS-2-I-PK
    RB69-DISS-2-I-PK
    SMARC HEAT SINK: SM-B69 Heat Sink (PASSIVE) for INDUSTRIAL version - Packaged
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  9. VA09
    VA09
    Camera Kits for SECO Boards
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  10. MB09-DISS-3-PK
    MB09-DISS-3-PK
    COM Express Type 6 - COMe-B09-BT6 Heat Sink (ACTIVE) Packaged
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Cpu Power Consumption
  1. range 10-25 W 24 item
  2. range < 10 W 34 item
  3. range < 5 W 7 item
  4. range > 25 W 12 item
Cpu Type
  1. AMD EPYC™ Embedded 3000 Series   1 item
  2. AMD Ryzen™ Embedded R1000 3 item
  3. AMD® G-Series™ 1 item
  4. AMD® R-Series  1 item
  5. AMD® Ryzen™ embedded V-Series™ 5 item
  6. Espressif ESP32-D0WD 3 item
  7. Intel® Atom™ 28 item
  8. Intel® Celeron® 30 item
  9. Intel® Core™  19 item
  10. Intel® Pentium®  18 item
  11. Intel® Xeon® 2 item
  12. MediaTek Genio 510 1 item
  13. MediaTek Genio 700 1 item
  14. NVIDIA Tegra® T30  1 item
  15. NXP i.MX 8M 6 item
  16. NXP i.MX 8M Mini 7 item
  17. NXP i.MX 8M Nano 3 item
  18. NXP i.MX 8M Plus 2 item
  19. NXP i.MX 8X 2 item
  20. NXP i.MX 93 2 item
  21. NXP i.MX 933/935 1 item
  22. NXP i.MX 95 1 item
  23. NXP i.MX6  19 item
  24. NXP i.MX8  3 item
  25. Qualcomm Snapdragon 1 item
  26. Qualcomm® QCS5430 1 item
  27. Qualcomm® QCS6490 2 item
  28. Rockchip PX30 1 item
  29. Rockchip RK3399 5 item
  30. Rockchip RK3568 1 item
  31. Zynq® Ultrascale+™  1 item
Ethernet
  1. ETHERNET≥1 103 item
  2. ETHERNET≥2 53 item
Form Factor
  1. Boxed Solutions 15 item
  2. COM Express® 17 item
  3. COM-HPC® 4 item
  4. ESP32 2 item
  5. Modular HMIs 14 item
  6. Qseven 12 item
  7. Single Board Computer  27 item
  8. SMARC 15 item
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 3 item
  2. 40x70 mm (µQseven, 1.57"x 2.76") 4 item
  3. 48,5 x 32,5 mm 2 item
  4. 67,6 x 36,7 mm 4 item
  5. ≤ 100 x 100mm 37 item
  6. ≤ 80 x 80mm 21 item
  7. ≥ 100 x 100mm 37 item
Form Factor Specification
  1. 3,5" 9 item
  2. COM Express Basic 8 item
  3. COM Express Compact 9 item
  4. COM-HPC Client 3 item
  5. embedded NUC 1 item
  6. ESP32 2 item
  7. Other Single Board Computers 9 item
  8. Pico-ITX 4 item
  9. Qseven 70x70 mm 8 item
  10. µQseven 70x40 4 item
Mass Storage
  1. CFAST slot 2 item
  2. M.2 NVMe SSD slot 14 item
  3. M.2 SATA SSD slot 15 item
  4. microSD card slot  27 item
  5. mSATA half-size slot 2 item
  6. onboard eMMC 87 item
  7. onboard SSD 5 item
  8. SATA channels ≥ 1 40 item
  9. SATA channels ≥ 2  30 item
  10. SATA channels ≥ 3 6 item
  11. SATA channels ≥ 4 4 item
  12. SD interface  39 item
  13. standard SATA connector 6 item
Memory
  1. soldered down 58 item
  2. SO_DIMM 27 item
  3. ≤1 93 item
  4. ≤16 24 item
  5. ≤2 79 item
  6. ≤4 68 item
  7. ≤8 54 item
  8. ≥32 24 item
Operating Temperature
  1. -20°C ÷ +60°C 42 item
  2. -20°C ÷ +70°C 14 item
  3. -40°C ÷ +85°C 54 item
  4. 0°C ÷ +50°C 79 item
  5. 0°C ÷ +60°C 94 item
  6. 20°C ÷ +70°C 39 item
Pci Express
  1. PCI-e lanes ≥ 1 43 item
  2. PCI-e lanes ≥ 2 35 item
  3. PCI-e lanes ≥ 3 26 item
  4. PCI-e lanes ≥ 4 26 item
  5. PCI-e lanes ≥ 5 18 item
Ttl Uarts
  1. ≥1 50 item
  2. ≥2 52 item
  3. ≥3 19 item
USB
  1. USB 2.0 ≥ 1  91 item
  2. USB 2.0 ≥ 2  79 item
  3. USB 2.0 ≥ 3 50 item
  4. USB 2.0 ≥ 4 42 item
  5. USB 2.0 ≥ 5 28 item
  6. USB 2.0 ≥ 6 26 item
  7. USB 3.0 ≥ 1 46 item
  8. USB 3.0 ≥ 2 35 item
  9. USB 3.0 ≥ 3 12 item
  10. USB 3.0 ≥ 4 8 item
  11. USB 3.1 ≥ 1 11 item
  12. USB 3.1 ≥ 2 8 item
  13. USB 3.2 ≥ 1 8 item
  14. USB 3.2 ≥ 2 13 item
  15. USB 4.0 ≥ 1 3 item
  16. USB 4.0 ≥ 2 4 item
  17. USB 4.0 ≥ 3 2 item
  18. USB 4.0 ≥ 4 3 item
  19. USB CLIENT 2 item
  20. USB OTG 40 item
Video Interfaces
  1. DDI 13 item
  2. DP 34 item
  3. DP++ 34 item
  4. DUAL CHANNEL LVDS 50 item
  5. eDP 41 item
  6. HDMI 64 item
  7. MIPI-CSI camera connector 12 item
  8. MIPI-DSI 13 item
  9. PARALLEL RGB 6 item
  10. SINGLE CHANNEL LVDS 52 item
  11. VGA 5 item
Wireless Connectivity
  1. M.2 SOCKET 1 KEY AND WLAN SLOT (WI-FI/BT typ.) 28 item
  2. M.2 SOCKET 2 KEY AND WLAN SLOT (MODEMS typ.) 12 item
  3. M.2 Socket 2 key B (SSD) 10 item
  4. ONBOARD WI-FI/BLE 27 item
Installation Depth
  1. 30-35 4 item
  2. 35-40 5 item
  3. 40-45 1 item
  4. >45 7 item
Screen Dimension
  1. <8 8 item
  2. 10-14 8 item
  3. 14-19 3 item
  4. >20 1 item