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Palladio 500 RPL AI

Modular embedded PC with 13th Gen Intel® Core™ processors and Intel® Arc™ Pro B50 Graphics

SOM-COMe-BT6-PTL

SOM-COMe-BT6-PTL

COM Express Rel. 3.1 Type 6 Module with Intel® Core™ Ultra Series 3 Processors (Codename: Panther Lake-H)

UDOO x86 II

UDOO x86 II

SBC based on Intel® Celeron® and Pentium® Applications Processor

UDOO VISION

UDOO VISION

Pico-ITX Single Board Computer with the Intel® Atom® X Series, Intel® Celeron® N Series and Intel® Pentium® N Series (codename: Apollo Lake) Processors

Titan 300 TGL-UP3 AI

Titan 300 TGL-UP3 AI

Fanless embedded computer with the 11th Gen Intel® Core™ and Intel® Celeron® SoCs (Codename: Tiger Lake UP3) plus Axelera AI Chip: Powered by a single Metis AIPU up to 120 TOPS 

Intel Processor

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Cpu Type
  1. Intel® Atom™ 1 item
  2. Intel® Celeron® 2 items
  3. Intel® Core™ 2 items
  4. Intel® Pentium® 1 item
Form Factor
  1. COM-HPC® 1 item
  2. Boxed Solutions 1 item
Form Factor Specification
  1. COM-HPC Client 1 item
Memory
  1. memory ≤8 1 item
  2. memory ≥32 2 items
  3. SO_DIMM 2 items
Mass Storage
  1. M.2 NVMe SSD slot 2 items
  2. M.2 SATA SSD slot 1 item
  3. microSD card slot 1 item
  4. onboard eMMC 1 item
  5. SATA channels ≥ 2 1 item
Operating Temperature
  1. -40°C ÷ +85°C 1 item
  2. 0°C ÷ +50°C 1 item
Pci Express
  1. PCI-e lanes ≥ 5 1 item
Ttl Uarts
  1. TTL Uarts ≥2 2 items
USB
  1. USB 2.0 ≥ 4 1 item
  2. USB 3.0 ≥ 1 1 item
  3. USB 3.2 ≥ 2 1 item
  4. USB 4.0 ≥ 4 1 item
Video Interfaces
  1. DDI 1 item
  2. DP++ 3 items
  3. eDP 1 item
  4. HDMI 2 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 12 items
  2. M.2 SOCKET 2 KEY 6 items
  3. M.2 Socket 2 key B 7 items
  4. ONBOARD WI-FI/BLE 3 items