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COM-HPC®
Qseven®
SMARC®
Myon MicroModule (SOM)
Trizeps SODIMM (SOM)
ETX®

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  1. USB
    USB 2.0 ≥ 5
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Cpu Maker
  1. AMD 2 items
  2. Intel 16 items
  3. MediaTek 2 items
  4. NXP 3 items
  5. Qualcomm 1 item
Cpu Power Consumption
  1. range 10-25 W 9 items
  2. range < 10 W 7 items
  3. range > 25 W 4 items
Cpu Type
  1. AMD Ryzen™ Embedded 1 item
  2. AMD® Ryzen™ embedded 1 item
  3. Intel® Atom™ 8 items
  4. Intel® Celeron® 8 items
  5. Intel® Core™ 10 items
  6. Intel® Pentium® 6 items
  7. Intel® Xeon® 2 items
  8. MediaTek Genio 510 1 item
  9. MediaTek Genio 700 1 item
  10. NXP i.MX 8M 1 item
  11. NXP i.MX 8M Mini 1 item
  12. NXP i.MX 8M Nano 1 item
  13. NXP i.MX 95 1 item
  14. Qualcomm® Dragonwing IQ-8 1 item
Ethernet
  1. ETHERNET≥1 22 items
  2. ETHERNET≥2 6 items
Form Factor
  1. COM Express® 12 items
  2. COM-HPC® 2 items
  3. Qseven 3 items
  4. SMARC 7 items
Form Factor Dimensions
  1. 40x70 mm (µQseven, 1.57"x 2.76") 1 item
  2. ≤ 100 x 100mm 18 items
  3. ≤ 80 x 80mm 5 items
  4. ≥ 100 x 100mm 3 items
  5. COM Express® 1 item
Form Factor Specification
  1. COM Express Basic 3 items
  2. COM Express Compact 9 items
  3. COM-HPC Client 2 items
  4. Qseven 70x70 mm 2 items
  5. µQseven 70x40 1 item
Memory
  1. memory ≤1 21 items
  2. memory ≤16 15 items
  3. memory ≤2 21 items
  4. memory ≤4 22 items
  5. memory ≤8 20 items
  6. memory ≥32 9 items
  7. soldered down 10 items
  8. SO_DIMM 12 items
  9. memory ≤32 1 item
Mass Storage
  1. CFAST slot 1 item
  2. M.2 NVMe SSD slot 2 items
  3. microSD card slot 3 items
  4. onboard eMMC 13 items
  5. onboard eMMC 2 items
  6. SATA channels ≥ 1 17 items
  7. SATA channels ≥ 2 14 items
  8. SATA channels ≥ 3 3 items
  9. SATA channels ≥ 4 1 item
  10. SD interface 4 items
  11. SD interface 2 items
  12. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 15 items
  2. -20°C ÷ +70°C 3 items
  3. -40°C ÷ +85°C 19 items
  4. 0°C ÷ +50°C 20 items
  5. 0°C ÷ +60°C 22 items
  6. 20°C ÷ +70°C 14 items
  7. -20°C ÷ +70°C 5 items
Pci Express
  1. PCI-e lanes ≥ 1 21 items
  2. PCI-e lanes ≥ 2 19 items
  3. PCI-e lanes ≥ 3 18 items
  4. PCI-e lanes ≥ 4 19 items
  5. PCI-e lanes ≥ 5 12 items
Ttl Uarts
  1. TTL Uarts ≥1 21 items
  2. TTL Uarts ≥2 19 items
  3. TTL Uarts ≥3 5 items
USB
  1. USB 2.0 ≥ 1 38 items
  2. USB 2.0 ≥ 2 35 items
  3. USB 2.0 ≥ 3 31 items
  4. USB 2.0 ≥ 4 31 items
  5. USB 2.0 ≥ 5 24 items
  6. USB 2.0 ≥ 6 25 items
  7. USB 3.0 ≥ 1 19 items
  8. USB 3.0 ≥ 2 18 items
  9. USB 3.0 ≥ 3 9 items
  10. USB 3.0 ≥ 4 7 items
  11. USB 3.1 ≥ 1 12 items
  12. USB 3.1 ≥ 2 8 items
  13. USB 3.2 ≥ 1 5 items
  14. USB 3.2 ≥ 2 8 items
  15. USB 4.0 ≥ 1 2 items
  16. USB 4.0 ≥ 2 5 items
  17. USB 4.0 ≥ 3 1 item
  18. USB 4.0 ≥ 4 2 items
  19. USB CLIENT 2 items
  20. USB OTG 18 items
Video Interfaces
  1. DDI 11 items
  2. DP 14 items
  3. DP++ 6 items
  4. DUAL CHANNEL LVDS 18 items
  5. eDP 20 items
  6. HDMI 18 items
  7. MIPI-CSI camera conn 4 items
  8. MIPI-DSI 2 items
  9. PARALLEL RGB 1 item
  10. SINGLE CHANNEL LVDS 16 items
  11. VGA 4 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 2 items
  2. ONBOARD WI-FI/BLE 3 items
Модули
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®