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COM-HPC®
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SMARC®
Myon MicroModule (SOM)
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  1. USB
    USB 3.1 ≥ 1
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Cpu Maker
  1. AMD 1 item
  2. Intel 7 items
  3. MediaTek 2 items
  4. Qualcomm 2 items
Cpu Power Consumption
  1. range 10-25 W 4 items
  2. range < 10 W 2 items
  3. range > 25 W 1 item
Cpu Type
  1. AMD EPYC™ Embedded 3 1 item
  2. Intel® Atom™ 3 items
  3. Intel® Celeron® 2 items
  4. Intel® Core™ 6 items
  5. Intel® Pentium® 2 items
  6. MediaTek Genio 510 1 item
  7. MediaTek Genio 700 1 item
  8. Qualcomm® QCS5430 1 item
  9. Qualcomm® QCS6490 1 item
Ethernet
  1. ETHERNET≥1 11 items
  2. ETHERNET≥2 5 items
Form Factor
  1. COM Express® 6 items
  2. COM-HPC® 1 item
  3. SMARC 5 items
Form Factor Dimensions
  1. ≤ 100 x 100mm 9 items
  2. ≤ 80 x 80mm 1 item
  3. ≥ 100 x 100mm 2 items
Form Factor Specification
  1. COM Express Basic 2 items
  2. COM Express Compact 4 items
  3. COM-HPC Client 1 item
Memory
  1. memory ≤1 11 items
  2. memory ≤16 8 items
  3. memory ≤2 12 items
  4. memory ≤4 12 items
  5. memory ≤8 12 items
  6. memory ≥32 4 items
  7. soldered down 6 items
  8. SO_DIMM 7 items
Mass Storage
  1. CFAST slot 1 item
  2. M.2 NVMe SSD slot 1 item
  3. microSD card slot 1 item
  4. onboard eMMC 6 items
  5. onboard eMMC 3 items
  6. SATA channels ≥ 1 8 items
  7. SATA channels ≥ 2 7 items
  8. SATA channels ≥ 3 2 items
  9. SD interface 2 items
Operating Temperature
  1. -20°C ÷ +60°C 9 items
  2. -20°C ÷ +70°C 1 item
  3. -40°C ÷ +85°C 8 items
  4. 0°C ÷ +50°C 11 items
  5. 0°C ÷ +60°C 11 items
  6. 20°C ÷ +70°C 8 items
  7. -20°C ÷ +70°C 6 items
Pci Express
  1. PCI-e lanes ≥ 1 10 items
  2. PCI-e lanes ≥ 2 10 items
  3. PCI-e lanes ≥ 3 8 items
  4. PCI-e lanes ≥ 4 8 items
  5. PCI-e lanes ≥ 5 7 items
Ttl Uarts
  1. TTL Uarts ≥1 11 items
  2. TTL Uarts ≥2 10 items
  3. TTL Uarts ≥3 2 items
USB
  1. USB 2.0 ≥ 1 38 items
  2. USB 2.0 ≥ 2 35 items
  3. USB 2.0 ≥ 3 31 items
  4. USB 2.0 ≥ 4 31 items
  5. USB 2.0 ≥ 5 24 items
  6. USB 2.0 ≥ 6 25 items
  7. USB 3.0 ≥ 1 19 items
  8. USB 3.0 ≥ 2 18 items
  9. USB 3.0 ≥ 3 9 items
  10. USB 3.0 ≥ 4 7 items
  11. USB 3.1 ≥ 1 12 items
  12. USB 3.1 ≥ 2 8 items
  13. USB 3.2 ≥ 1 5 items
  14. USB 3.2 ≥ 2 8 items
  15. USB 4.0 ≥ 1 2 items
  16. USB 4.0 ≥ 2 5 items
  17. USB 4.0 ≥ 3 1 item
  18. USB 4.0 ≥ 4 2 items
  19. USB CLIENT 2 items
  20. USB OTG 18 items
Video Interfaces
  1. DDI 5 items
  2. DP 8 items
  3. DP++ 2 items
  4. DUAL CHANNEL LVDS 9 items
  5. eDP 10 items
  6. HDMI 8 items
  7. MIPI-CSI camera conn 1 item
  8. MIPI-DSI 2 items
  9. PARALLEL RGB 1 item
  10. SINGLE CHANNEL LVDS 5 items
  11. VGA 2 items
Wireless Connectivity
  1. M.2 SOCKET 1 KEY 3 items
  2. ONBOARD WI-FI/BLE 1 item
Модули
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®