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COM-HPC®
Qseven®
SMARC®
Myon MicroModule (SOM)
Trizeps SODIMM (SOM)
ETX®

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  1. USB
    USB 3.0 ≥ 2
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Cpu Maker
  1. AMD 3 items
  2. Intel 10 items
  3. NXP 5 items
  4. Qualcomm 1 item
Cpu Power Consumption
  1. range 10-25 W 9 items
  2. range < 10 W 7 items
  3. range < 5 W 2 items
  4. range > 25 W 4 items
Cpu Type
  1. AMD Ryzen™ Embedded 1 item
  2. AMD® Ryzen™ embedded 1 item
  3. Intel® Atom™ 6 items
  4. Intel® Celeron® 5 items
  5. Intel® Core™ 6 items
  6. Intel® Pentium® 4 items
  7. Intel® Xeon® 1 item
  8. NXP i.MX 8M 2 items
  9. NXP i.MX 8M Plus 2 items
  10. NXP i.MX 8X 1 item
  11. Zynq® Ultras 1 item
  12. Qualcomm® Dragonwing IQ-8 1 item
Ethernet
  1. ETHERNET≥1 15 items
  2. ETHERNET≥2 6 items
Form Factor
  1. COM Express® 10 items
  2. Qseven 1 item
  3. SMARC 6 items
  4. Trizeps SODIMM SOM 2 items
Form Factor Dimensions
  1. 67,6 x 36,7 mm 2 items
  2. ≤ 100 x 100mm 13 items
  3. ≤ 80 x 80mm 6 items
  4. ≥ 100 x 100mm 3 items
  5. COM Express® 1 item
Form Factor Specification
  1. COM Express Basic 3 items
  2. COM Express Compact 7 items
  3. Qseven 70x70 mm 1 item
Memory
  1. memory ≤1 18 items
  2. memory ≤16 8 items
  3. memory ≤2 17 items
  4. memory ≤4 18 items
  5. memory ≤8 15 items
  6. memory ≥32 5 items
  7. soldered down 8 items
  8. SO_DIMM 10 items
  9. memory ≤32 1 item
Mass Storage
  1. CFAST slot 1 item
  2. M.2 NVMe SSD slot 1 item
  3. microSD card slot 1 item
  4. onboard eMMC 13 items
  5. SATA channels ≥ 1 13 items
  6. SATA channels ≥ 2 11 items
  7. SATA channels ≥ 3 2 items
  8. SATA channels ≥ 4 1 item
  9. SD interface 8 items
  10. SD interface 1 item
  11. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
  1. -20°C ÷ +60°C 11 items
  2. -40°C ÷ +85°C 16 items
  3. 0°C ÷ +50°C 14 items
  4. 0°C ÷ +60°C 16 items
  5. 20°C ÷ +70°C 11 items
  6. -20°C ÷ +70°C 3 items
Pci Express
  1. PCI-e lanes ≥ 1 17 items
  2. PCI-e lanes ≥ 2 14 items
  3. PCI-e lanes ≥ 3 13 items
  4. PCI-e lanes ≥ 4 14 items
  5. PCI-e lanes ≥ 5 8 items
Ttl Uarts
  1. TTL Uarts ≥1 17 items
  2. TTL Uarts ≥2 15 items
  3. TTL Uarts ≥3 7 items
USB
  1. USB 2.0 ≥ 1 42 items
  2. USB 2.0 ≥ 2 39 items
  3. USB 2.0 ≥ 3 35 items
  4. USB 2.0 ≥ 4 35 items
  5. USB 2.0 ≥ 5 27 items
  6. USB 2.0 ≥ 6 27 items
  7. USB 3.0 ≥ 1 23 items
  8. USB 3.0 ≥ 2 19 items
  9. USB 3.0 ≥ 3 10 items
  10. USB 3.0 ≥ 4 7 items
  11. USB 3.1 ≥ 1 12 items
  12. USB 3.1 ≥ 2 8 items
  13. USB 3.2 ≥ 1 5 items
  14. USB 3.2 ≥ 2 8 items
  15. USB 4.0 ≥ 1 2 items
  16. USB 4.0 ≥ 2 5 items
  17. USB 4.0 ≥ 3 1 item
  18. USB 4.0 ≥ 4 2 items
  19. USB CLIENT 2 items
  20. USB OTG 18 items
Video Interfaces
  1. DDI 9 items
  2. DP 11 items
  3. DP++ 4 items
  4. DUAL CHANNEL LVDS 17 items
  5. eDP 13 items
  6. HDMI 16 items
  7. MIPI-CSI camera conn 4 items
  8. MIPI-DSI 6 items
  9. PARALLEL RGB 3 items
  10. SINGLE CHANNEL LVDS 18 items
  11. VGA 3 items
Wireless Connectivity
  1. ONBOARD WI-FI/BLE 3 items
Модули
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®