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  1. Memory
    SO_DIMM
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Cpu Maker
  1. AMD 5 items
  2. Intel 15 items
Cpu Power Consumption
  1. range 10-25 W 10 items
  2. range < 10 W 3 items
  3. range > 25 W 8 items
Cpu Type
  1. AMD EPYC™ Embedded 3 1 item
  2. AMD Ryzen™ Embedded 2 items
  3. AMD® Ryzen™ embedded 2 items
  4. Intel® Atom™ 5 items
  5. Intel® Celeron® 6 items
  6. Intel® Core™ 12 items
  7. Intel® Pentium® 3 items
  8. Intel® Xeon® 1 item
Ethernet
  1. ETHERNET≥1 16 items
  2. ETHERNET≥2 5 items
Form Factor
  1. COM Express® 16 items
  2. COM-HPC® 4 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 item
  2. ≤ 100 x 100mm 10 items
  3. ≥ 100 x 100mm 4 items
  4. COM Express® 2 items
Form Factor Specification
  1. COM Express Basic 5 items
  2. COM Express Compact 11 items
  3. COM-HPC Client 3 items
Memory
  1. memory ≤1 43 items
  2. memory ≤16 18 items
  3. memory ≤2 44 items
  4. memory ≤4 40 items
  5. memory ≤8 32 items
  6. memory ≥32 18 items
  7. soldered down 26 items
  8. SO_DIMM 20 items
  9. memory ≤32 1 item
  10. I2C EEPROM 1 item
  11. UFS 4.0 module on-board, optional, up to 256GB microSD card slot 1 item
Mass Storage
  1. CFAST slot 1 item
  2. M.2 NVMe SSD slot 5 items
  3. M.2 SATA SSD slot 1 item
  4. microSD card slot 2 items
  5. onboard eMMC 7 items
  6. SATA channels ≥ 1 15 items
  7. SATA channels ≥ 2 15 items
  8. SATA channels ≥ 2 4 items
  9. SATA channels ≥ 3 3 items
  10. SATA channels ≥ 4 1 item
  11. SD interface 2 items
Operating Temperature
  1. -20°C ÷ +60°C 9 items
  2. -20°C ÷ +70°C 1 item
  3. -40°C ÷ +85°C 13 items
  4. 0°C ÷ +50°C 12 items
  5. 0°C ÷ +60°C 17 items
  6. 20°C ÷ +70°C 8 items
  7. -20°C ÷ +70°C 3 items
Pci Express
  1. PCI-e lanes ≥ 1 16 items
  2. PCI-e lanes ≥ 2 16 items
  3. PCI-e lanes ≥ 3 15 items
  4. PCI-e lanes ≥ 4 15 items
  5. PCI-e lanes ≥ 5 17 items
Ttl Uarts
  1. TTL Uarts ≥1 15 items
  2. TTL Uarts ≥2 17 items
USB
  1. USB 2.0 ≥ 1 14 items
  2. USB 2.0 ≥ 2 14 items
  3. USB 2.0 ≥ 3 14 items
  4. USB 2.0 ≥ 4 15 items
  5. USB 2.0 ≥ 5 13 items
  6. USB 2.0 ≥ 6 15 items
  7. USB 3.0 ≥ 1 10 items
  8. USB 3.0 ≥ 2 10 items
  9. USB 3.0 ≥ 3 10 items
  10. USB 3.0 ≥ 4 7 items
  11. USB 3.1 ≥ 1 7 items
  12. USB 3.1 ≥ 2 7 items
  13. USB 3.2 ≥ 1 3 items
  14. USB 3.2 ≥ 2 4 items
  15. USB 4.0 ≥ 1 1 item
  16. USB 4.0 ≥ 2 2 items
  17. USB 4.0 ≥ 3 1 item
  18. USB 4.0 ≥ 4 2 items
  19. USB CLIENT 1 item
  20. USB OTG 2 items
Video Interfaces
  1. DDI 17 items
  2. DP 14 items
  3. DP++ 4 items
  4. DUAL CHANNEL LVDS 14 items
  5. eDP 19 items
  6. HDMI 18 items
  7. MIPI-CSI camera conn 1 item
  8. MIPI-DSI 1 item
  9. PARALLEL RGB 1 item
  10. SINGLE CHANNEL LVDS 15 items
  11. VGA 5 items
Wireless Connectivity
  1. ONBOARD WI-FI/BLE 1 item
Модули
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®