SOM-COMe-CT6-P100
Основные моменты
GraphicsIntegrated AMD Radeon™ RDNA™ 3.5 GPU, up to four 4K displays supported
Memory2x DDR5-5600 SO-DIMM Slots with ECC support, up to 96GB
ConnectivityAMD XDNA™ 2 NPU, up to 50 TOPS
Security & Compliance by Design
SECO products integrate security functions that enable out-of-the-box compliance with the RED directive [EN18031-1]. Certification documentation is available upon request. Security monitoring, patching and update automation are powered by Clea.
Secure Boot
Built-in Secure Boot to ensure system integrity from the first startup.
OTA Updates
Remote and secure software update distribution for your devices.
Device Monitoring
Continuous monitoring of device status and activity with Clea.
Secure Operating System
Yocto-based OS integration for customizable and secure system builds.
Certified Security
Compliance with EN18031-1 standards for secure and reliable embedded systems.
Docker Technology
Isolated and flexible application management through containerization.
Applications Hub
Откройте для себя приложения, совместимые с этим продуктом, доступные в SECO Application Hub: готовые решения для ускорения разработки и развертывания интеллектуальных функций.
Machine Alert Assistance with Operator Recognition
HMI system that uses AI to recognize operators during alerts and show personalized troubleshooting instructions.
People Counter
Lightweight real-time people counting model based on quantized YOLOX, optimized for edge devices using LiteRT (TensorFlow Lite) .
PoseNet for Multi-Person Pose Detection
Lightweight and quantized PoseNet model for real-time multi-person pose estimation on edge hardware.
HRNet for Human Pose Estimation
High-resolution neural network for accurate keypoint detection in human pose estimation tasks.
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COM Express® 3.1 Type 6 Compact Module with AMD Ryzen™ AI Embedded P100 Series |
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AMD Ryzen™ Embedded P121, 4x Zen5 CPU cores Dual Thread @4.4 GHz, 30 TOPS XDNA 2™ NPU, 1x RDNA 3.5 GPU, TDP 15-54W (nominal 28W), 0° to 105°C AMD Ryzen™ Embedded P132, 6x Zen5 CPU cores Dual Thread @4.5 GHz, 50 TOPS XDNA 2™ NPU, 2x RDNA 3.5 GPU, TDP 15-54W (nominal 28W), 0° to 105°C AMD Ryzen™ Embedded P121i, 4x Zen5 CPU cores Dual Thread @4.4 GHz, 30 TOPS XDNA 2™ NPU, 1x RDNA 3.5 GPU, TDP 15-54W (nominal 28W), -40° to 105°C AMD Ryzen™ Embedded P132i, 6x Zen5 CPU cores Dual Thread @4.5 GHz, 50 TOPS XDNA 2™ NPU, 2x RDNA 3.5 GPU, TDP 15-54W (nominal 28W), -40° to 105°C |
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2x DDR5-5600 SO-DIMM slots with ECC support, up to 96GB |
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AMD Radeon™ RDNA™ 3.5 GPU with up to 4 Compute Units (CU) Up to 4 independent displays supported HW accelerated video decode 8K30 HEVC & VP9 (8 and 10 bits), 10b AV1 HW accelerated video encode 8K30 HEVC (8 and 10 bits), 10b AV1 |
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2x DDI interfaces supporting DP 2.0, HDMI® 2.0b, DP Alt mode over Type-C 1x DDI interface supporting DP 2.0 / HDMI® 2.0b eDP 1.4 or LVDS dual channel interface (factory alternatives) |
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Max resolution 4x 4K (concurrent) Max resolution on LVDS: 1920x1200 |
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Optional 2x SATA Gen3 channels (commercial range modules only) |
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1x Nbase-T ethernet port with TSN, supporting up to 2.5Gbps |
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8x USB 2.0 data lanes Up to 1x 10Gbps + 3x 5Gbps Superspeed lanes 2x USB 4 Gen3x2 ports |
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Up to 7 Gen 4 PCI-e x1 lanes PCI-e Graphics (PEG) x8 Gen 4 port |
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HD audio interface Soundwire interface |
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2x 2-wires UARTs |
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SPI, I2C, SM bus, thermal management, FAN management LPC bus Optional TPM 2.0 on-board LID#/SLEEP#/PWRBTN#, watchdog 4x general purpose input (GPI), 4x general purpose output (GPO) |
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+12VDC ± 10%, +5VSB (optional), +3VRTC (optional) |
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Windows 11 LTSC |
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0°C to +60°C (commercial grade version) -40° to +85°C (industrial grade version). |
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95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout) |
Номер детали
COM Express® 3.1 Type 6 Compact Module with AMD Ryzen™ AI Embedded P100 Series