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COM-HPC®
Qseven®
SMARC®
Myon MicroModule (SOM)
Trizeps SODIMM (SOM)
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    COM Express®
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Cpu Maker
  1. AMD 6 items
  2. Intel 14 items
  3. Qualcomm 1 item
  4. Rockchip 1 item
Cpu Power Consumption
  1. range 10-25 W 10 items
  2. range < 10 W 3 items
  3. range > 25 W 8 items
Cpu Type
  1. AMD EPYC™ Embedded 3 1 item
  2. AMD Ryzen™ Embedded 2 items
  3. AMD® Ryzen™ embedded 3 items
  4. Intel® Atom™ 5 items
  5. Intel® Celeron® 5 items
  6. Intel® Core™ 11 items
  7. Intel® Pentium® 3 items
  8. Intel® Xeon® 1 item
  9. Rockchip RK3588 1 item
  10. Qualcomm Dragonwing IQ-X 1 item
Ethernet
  1. ETHERNET≥1 19 items
  2. ETHERNET≥2 2 items
Form Factor
  1. COM Express® 22 items
  2. COM-HPC® 5 items
  3. Myon MicroModule SOM 2 items
  4. Qseven 11 items
  5. SMARC 16 items
  6. Trizeps SODIMM SOM 4 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 3 items
  2. ≤ 100 x 100mm 12 items
  3. ≥ 100 x 100mm 4 items
  4. COM Express® 3 items
Form Factor Specification
  1. COM Express Basic 8 items
  2. COM Express Compact 13 items
Memory
  1. memory ≤1 13 items
  2. memory ≤16 12 items
  3. memory ≤2 14 items
  4. memory ≤4 14 items
  5. memory ≤8 14 items
  6. memory ≥32 15 items
  7. soldered down 1 item
  8. SO_DIMM 16 items
  9. I2C EEPROM 1 item
  10. UFS 4.0 module on-board, optional, up to 256GB microSD card slot 1 item
Mass Storage
  1. CFAST slot 1 item
  2. I2C EEPROM 1 item
  3. M.2 NVMe SSD slot 2 items
  4. M.2 SATA SSD slot 2 items
  5. microSD card slot 3 items
  6. onboard eMMC 8 items
  7. SATA channels ≥ 1 16 items
  8. SATA channels ≥ 2 15 items
  9. SATA channels ≥ 2 1 item
  10. SATA channels ≥ 2 3 items
  11. SATA channels ≥ 3 3 items
  12. SATA channels ≥ 4 1 item
  13. SD interface 2 items
  14. UFS 4.0 module on-board, optional, up to 1 TB microSD card slot 1 item
Operating Temperature
  1. -20°C ÷ +60°C 11 items
  2. -20°C ÷ +70°C 2 items
  3. -40°C ÷ +85°C 14 items
  4. 0°C ÷ +50°C 13 items
  5. 0°C ÷ +60°C 20 items
  6. 20°C ÷ +70°C 8 items
  7. -20°C ÷ +70°C 3 items
Pci Express
  1. PCI-e lanes ≥ 1 15 items
  2. PCI-e lanes ≥ 2 15 items
  3. PCI-e lanes ≥ 3 15 items
  4. PCI-e lanes ≥ 4 16 items
  5. PCI-e lanes ≥ 5 18 items
Ttl Uarts
  1. TTL Uarts ≥1 14 items
  2. TTL Uarts ≥2 16 items
USB
  1. USB 2.0 ≥ 1 14 items
  2. USB 2.0 ≥ 2 13 items
  3. USB 2.0 ≥ 3 13 items
  4. USB 2.0 ≥ 4 13 items
  5. USB 2.0 ≥ 5 13 items
  6. USB 2.0 ≥ 6 15 items
  7. USB 3.0 ≥ 1 10 items
  8. USB 3.0 ≥ 2 10 items
  9. USB 3.0 ≥ 3 10 items
  10. USB 3.0 ≥ 4 7 items
  11. USB 3.1 ≥ 1 6 items
  12. USB 3.1 ≥ 2 6 items
  13. USB 3.2 ≥ 1 1 item
  14. USB 3.2 ≥ 2 2 items
  15. USB 4.0 ≥ 2 3 items
  16. USB CLIENT 2 items
  17. USB OTG 4 items
Video Interfaces
  1. DDI 17 items
  2. DP 14 items
  3. DP++ 2 items
  4. DUAL CHANNEL LVDS 16 items
  5. eDP 19 items
  6. HDMI 17 items
  7. MIPI-CSI camera conn 3 items
  8. PARALLEL RGB 1 item
  9. SINGLE CHANNEL LVDS 15 items
  10. VGA 5 items
Wireless Connectivity
  1. /s/n/snapdragon-x_per_sito.jpg 1 item
Модули
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®