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  1. AMD EPYC™ Embedded 3 1 item
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  4. Intel® Atom™ 10 items
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  15. NXP i.MX 8X 1 item
  16. NXP i.MX 933/935 1 item
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  20. Qualcomm Snapdragon 1 item
  21. Qualcomm® QCS5430 1 item
  22. Qualcomm® QCS6490 1 item
  23. Rockchip RK3588 1 item
  24. Zynq® Ultras 1 item
  25. Qualcomm Dragonwing IQ-X 1 item
  26. Qualcomm Dragonwing 1 item
  27. Qualcomm® Dragonwing IQ-8 1 item
Memory
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  2. UFS 3.1 module on-board 1 item
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Mass Storage
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  2. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 item
Operating Temperature
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  2. 0°C ÷ +60°C 1 item
USB
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  2. USB 3.0 ≥ 4 1 item
Video Interfaces
  1. DP 1 item
  2. DUAL CHANNEL LVDS 1 item
  3. eDP 1 item
  4. MIPI-CSI camera conn 1 item
  5. SINGLE CHANNEL LVDS 1 item
Модули
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®