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COM-HPC®
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    Qualcomm® QCS5430
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Cpu Type
  1. AMD EPYC™ Embedded 3 1 item
  2. AMD Ryzen™ Embedded 2 items
  3. AMD® Ryzen™ embedded 3 items
  4. Intel® Atom™ 10 items
  5. Intel® Celeron® 10 items
  6. Intel® Core™ 18 items
  7. Intel® Pentium® 7 items
  8. Intel® Xeon® 2 items
  9. MediaTek Genio 510 1 item
  10. MediaTek Genio 700 1 item
  11. NXP i.MX 8M 3 items
  12. NXP i.MX 8M Mini 3 items
  13. NXP i.MX 8M Nano 2 items
  14. NXP i.MX 8M Plus 2 items
  15. NXP i.MX 8X 1 item
  16. NXP i.MX 933/935 1 item
  17. NXP i.MX 95 1 item
  18. NXP i.MX6 4 items
  19. NXP i.MX8 1 item
  20. Qualcomm Snapdragon 1 item
  21. Qualcomm® QCS5430 1 item
  22. Qualcomm® QCS6490 1 item
  23. Rockchip RK3588 1 item
  24. Zynq® Ultras 1 item
  25. Qualcomm Dragonwing IQ-X 1 item
  26. Qualcomm Dragonwing 1 item
  27. Qualcomm® Dragonwing IQ-8 1 item
Ethernet
  1. ETHERNET≥1 1 item
  2. ETHERNET≥2 1 item
Memory
  1. memory ≤1 1 item
  2. memory ≤2 1 item
  3. memory ≤4 1 item
  4. memory ≤8 1 item
  5. soldered down 1 item
Mass Storage
  1. onboard eMMC 1 item
  2. SD interface 1 item
Operating Temperature
  1. -20°C ÷ +60°C 1 item
  2. 0°C ÷ +50°C 1 item
  3. 0°C ÷ +60°C 1 item
  4. 20°C ÷ +70°C 1 item
  5. -20°C ÷ +70°C 1 item
Pci Express
  1. PCI-e lanes ≥ 1 1 item
  2. PCI-e lanes ≥ 2 1 item
Ttl Uarts
  1. TTL Uarts ≥1 1 item
  2. TTL Uarts ≥2 1 item
USB
  1. USB 2.0 ≥ 1 1 item
  2. USB 2.0 ≥ 2 1 item
  3. USB 2.0 ≥ 3 1 item
  4. USB 2.0 ≥ 4 1 item
  5. USB 3.1 ≥ 1 1 item
Video Interfaces
  1. DP 1 item
  2. DUAL CHANNEL LVDS 1 item
  3. eDP 1 item
  4. MIPI-CSI camera conn 1 item
  5. MIPI-DSI 1 item
Модули
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®