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COM-HPC®
Qseven®
SMARC®
Myon MicroModule (SOM)
Trizeps SODIMM (SOM)
ETX®

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Покупаем сейчас по
  1. Cpu Type
    Intel® Core™
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Shopping Options
Cpu Power Consumption
  1. range 10-25 W 4 items
  2. range < 10 W 1 item
  3. range > 25 W 2 items
Cpu Type
  1. AMD EPYC™ Embedded 3 1 item
  2. AMD Ryzen™ Embedded 2 items
  3. AMD® Ryzen™ embedded 3 items
  4. Intel® Atom™ 14 items
  5. Intel® Celeron® 14 items
  6. Intel® Core™ 18 items
  7. Intel® Pentium® 7 items
  8. Intel® Xeon® 2 items
  9. MediaTek Genio 510 1 item
  10. MediaTek Genio 700 1 item
  11. NXP i.MX 8M 3 items
  12. NXP i.MX 8M Mini 3 items
  13. NXP i.MX 8M Nano 2 items
  14. NXP i.MX 8M Plus 2 items
  15. NXP i.MX 8X 1 item
  16. NXP i.MX 933/935 1 item
  17. NXP i.MX 95 1 item
  18. NXP i.MX6 4 items
  19. NXP i.MX8 1 item
  20. Qualcomm Snapdragon 1 item
  21. Qualcomm® QCS5430 1 item
  22. Qualcomm® QCS6490 1 item
  23. Rockchip RK3588 1 item
  24. Zynq® Ultras 1 item
  25. Qualcomm Dragonwing IQ-X 1 item
  26. Qualcomm® Dragonwing IQ-8 1 item
Ethernet
  1. ETHERNET≥1 12 items
  2. ETHERNET≥2 6 items
Form Factor
  1. COM Express® 11 items
  2. COM-HPC® 5 items
  3. SMARC 2 items
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 3 items
  2. ≤ 100 x 100mm 6 items
  3. ≤ 80 x 80mm 1 item
  4. ≥ 100 x 100mm 2 items
  5. COM Express® 2 items
Form Factor Specification
  1. COM Express Basic 6 items
  2. COM Express Compact 5 items
  3. COM-HPC Client 4 items
Memory
  1. memory ≤1 8 items
  2. memory ≤16 10 items
  3. memory ≤2 9 items
  4. memory ≤4 9 items
  5. memory ≤8 9 items
  6. memory ≥32 11 items
  7. soldered down 3 items
  8. SO_DIMM 12 items
Mass Storage
  1. CFAST slot 1 item
  2. M.2 NVMe SSD slot 5 items
  3. M.2 SATA SSD slot 3 items
  4. microSD card slot 1 item
  5. onboard eMMC 6 items
  6. SATA channels ≥ 1 11 items
  7. SATA channels ≥ 2 11 items
  8. SATA channels ≥ 2 1 item
  9. SATA channels ≥ 2 2 items
  10. SATA channels ≥ 3 3 items
  11. SATA channels ≥ 4 1 item
  12. SD interface 1 item
Operating Temperature
  1. -20°C ÷ +60°C 4 items
  2. -20°C ÷ +70°C 1 item
  3. -40°C ÷ +85°C 9 items
  4. 0°C ÷ +50°C 8 items
  5. 0°C ÷ +60°C 16 items
  6. 20°C ÷ +70°C 3 items
  7. -20°C ÷ +70°C 3 items
Pci Express
  1. PCI-e lanes ≥ 1 11 items
  2. PCI-e lanes ≥ 2 11 items
  3. PCI-e lanes ≥ 3 10 items
  4. PCI-e lanes ≥ 4 12 items
  5. PCI-e lanes ≥ 5 14 items
Ttl Uarts
  1. TTL Uarts ≥1 9 items
  2. TTL Uarts ≥2 11 items
USB
  1. USB 2.0 ≥ 1 11 items
  2. USB 2.0 ≥ 2 11 items
  3. USB 2.0 ≥ 3 11 items
  4. USB 2.0 ≥ 4 12 items
  5. USB 2.0 ≥ 5 10 items
  6. USB 2.0 ≥ 6 12 items
  7. USB 3.0 ≥ 1 6 items
  8. USB 3.0 ≥ 2 6 items
  9. USB 3.0 ≥ 3 6 items
  10. USB 3.0 ≥ 4 2 items
  11. USB 3.1 ≥ 1 6 items
  12. USB 3.1 ≥ 2 6 items
  13. USB 3.2 ≥ 1 3 items
  14. USB 3.2 ≥ 2 5 items
  15. USB 4.0 ≥ 1 2 items
  16. USB 4.0 ≥ 2 5 items
  17. USB 4.0 ≥ 3 1 item
  18. USB 4.0 ≥ 4 2 items
  19. USB CLIENT 1 item
  20. USB OTG 4 items
Video Interfaces
  1. DDI 12 items
  2. DP 8 items
  3. DP++ 6 items
  4. DUAL CHANNEL LVDS 10 items
  5. eDP 17 items
  6. HDMI 15 items
  7. MIPI-CSI camera conn 5 items
  8. MIPI-DSI 1 item
  9. PARALLEL RGB 1 item
  10. SINGLE CHANNEL LVDS 8 items
  11. VGA 4 items
Wireless Connectivity
  1. ONBOARD WI-FI/BLE 1 item
Модули
  • COM Express®
  • COM-HPC®
  • Qseven®
  • SMARC®
  • Myon MicroModule (SOM)
  • Trizeps SODIMM (SOM)
  • ETX®