SECOMExp-iCORE-XT [Discontinued]

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Industrial temperature range COM-Express™ Module with Intel® Core™ i7-660UE Processor and Intel® HM55 Express Chipset with Dual Channel Memory

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Highlights

CPUIntel®Core™ i7-660UE Processor and Intel® HM55 Express Chipset with Dual Channel Memory
Graphicsintegrated Intel® HD graphics controller
Memory1066MHz DDR3

SECOMExp-iCORE-XT is a basic form factor, type 2 COM-Express™ module designed by SECO, also compliant to latest COM Express™ Extension specifications, based on the Intel® Core™ i7-660UE CPU and high performance Intel® HM55 Express Chipset, integrating HDMI, DVI and Display Port support, with usage of DDR3 Memories with Speed up to 1066MHz. With the reduction of the FSB of the CPU to a fixed frequency of 100MHz, the adoption of industrial temperature range components (except for CPU and Chipset), and the use of adequate heatsinks for higher temperatures, this board can offer the performance(*) of Intel iCore CPU in harsher environments, requiring extended temperature range. (*) Performances of i7-660UE with reduced FSB are equivalent to those of i7-620UE at full speed FSB

Security & Compliance by Design

SECO products integrate security functions that enable out-of-the-box compliance with the RED directive [EN18031-1]. Certification documentation is available upon request. Security monitoring, patching and update automation are powered by Clea.

Secure Boot

Built-in Secure Boot to ensure system integrity from the first startup.

OTA Updates

Remote and secure software update distribution for your devices.

Device Monitoring

Continuous monitoring of device status and activity with Clea.

Secure Operating System

Yocto-based OS integration for customizable and secure system builds.

Certified Security

Compliance with EN18031-1 standards for secure and reliable embedded systems.

Docker Technology

Isolated and flexible application management through containerization.

Application Hub

Scopri le applicazioni compatibili con questo prodotto disponibili su SECO Application Hub: soluzioni pronte all’uso per accelerare lo sviluppo e l’implementazione di funzionalità intelligenti.

Machine Alert Assistance with Operator Recognition

Specifiche teniche

Descrizione	SECOMExp-iCORE-XT is a basic form factor, type 2 COM-Express™ module designed by SECO, also compliant to latest COM Express™ Extension specifications, based on the Intel® Core™ i7-660UE CPU and high performance Intel® HM55 Express Chipset, integrating HDMI, DVI and Display Port support, with usage of DDR3 Memories with Speed up to 1066MHz. With the reduction of the FSB of the CPU to a fixed frequency of 100MHz, the adoption of industrial temperature range components (except for CPU and Chipset), and the use of adequate heatsinks for higher temperatures, this board can offer the performance() of Intel iCore CPU in harsher environments, requiring extended temperature range. () Performances of i7-660UE with reduced FSB are equivalent to those of i7-620UE at full speed FSB
CPU Description	Intel® Core™ i7-660UE @ 1GHz, 4MB Cache
Memory Description	1066MHz DDR3 selected modules on two SO-DIMMs Supporting dual channel
Graphics Description	integrated Intel® HD graphics controller Dual independent display support
Video Interfaces Description	LVDS, Single/Dual Channel 18/24 Bit LVDS Transmitter
Video Resolution Description	Up to 2048 x 1536 on CRT interface Up to 2560 x 1600 @ 60Hz with Display Port Up to 1920 x 1200 @ 60Hz using HDMI/DVI
Mass Storage Description	1 x P-ATA channel 4 x S-ATA channels
Networking Description	Gigabit Ethernet port
USB Description	8x USB 2.0 ports
PCI Description	PCI Express Graphics x16 interface Multiplexed with HDMI, DVI and Display Port 4x PCI Express x1 ports
Audio Description	HD Audio Interface
Other Interfaces	PCI Bus LPC BUS for legacy peripherals SMBus
Power Supply	+12VDC and +5VSB for ATX mode
Operating Temperature Description	-40°C ÷ +85°C (industrial version) *Measured at any point of the heatspreader/heatsink during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider specific cooling solutions for the final system.
Dimensions	125 x 95 mm (COM Express Basic, 4.92” x 3,74”)