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  1. Mass Storage
    SD interface
  2. Video Interfaces
    SINGLE CHANNEL LVDS
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Opzioni
Cpu Maker
  1. AMD 1 elemento
  2. Intel 3 elementi
  3. NVIDIA 1 elemento
  4. NXP 8 elementi
  5. Qualcomm 1 elemento
Cpu Power Consumption
  1. range 10-25 W 5 elementi
  2. range < 10 W 10 elementi
  3. range < 5 W 1 elemento
  4. range > 25 W 2 elementi
Cpu Type
  1. Intel® Atom™ 2 elementi
  2. Intel® Celeron® 3 elementi
  3. Intel® Core™ 1 elemento
  4. Intel® Pentium® 2 elementi
  5. Intel® Xeon® 1 elemento
  6. NVIDIA Tegra® T30 1 elemento
  7. NXP i.MX 8M 1 elemento
  8. NXP i.MX 8M Mini 1 elemento
  9. NXP i.MX 8M Nano 1 elemento
  10. NXP i.MX 8M Plus 1 elemento
  11. NXP i.MX 8X 1 elemento
  12. NXP i.MX 933/935 1 elemento
  13. NXP i.MX6 2 elementi
  14. NXP i.MX8 1 elemento
  15. Qualcomm® QCS6490 1 elemento
  16. Zynq® Ultras 1 elemento
Ethernet
  1. ETHERNET≥1 11 elementi
  2. ETHERNET≥2 6 elementi
Form Factor
  1. COM Express® 1 elemento
  2. Qseven 6 elementi
  3. SMARC 7 elementi
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 1 elemento
  2. 40x70 mm (µQseven, 1.57"x 2.76") 1 elemento
  3. ≤ 100 x 100mm 10 elementi
  4. ≤ 80 x 80mm 11 elementi
  5. ≥ 100 x 100mm 2 elementi
Form Factor Specification
  1. COM Express Basic 1 elemento
  2. Qseven 70x70 mm 4 elementi
  3. µQseven 70x40 2 elementi
InstallationDepth
  1. memory ≤4 1 elemento
  2. memory ≤1 1 elemento
  3. memory ≤2 1 elemento
  4. soldered down 1 elemento
Memory
  1. memory ≤1 12 elementi
  2. memory ≤16 1 elemento
  3. memory ≤2 13 elementi
  4. memory ≤4 10 elementi
  5. memory ≤8 4 elementi
  6. memory ≥32 1 elemento
  7. soldered down 13 elementi
  8. SO_DIMM 1 elemento
Mass Storage
  1. mSATA half-size slot 1 elemento
  2. onboard SSD 3 elementi
  3. standard SATA connector 2 elementi
  4. soldered down 1 elemento
  5. CFAST slot 1 elemento
  6. M.2 NVMe SSD slot 3 elementi
  7. M.2 SATA SSD slot 5 elementi
  8. microSD card slot 12 elementi
  9. onboard eMMC 2 elementi
  10. onboard eMMC 29 elementi
  11. onboard eMMC 6 elementi
  12. SATA channels ≥ 1 21 elementi
  13. SATA channels ≥ 1 2 elementi
  14. SATA channels ≥ 2 3 elementi
  15. SATA channels ≥ 2 12 elementi
  16. SATA channels ≥ 3 3 elementi
  17. SATA channels ≥ 4 1 elemento
  18. SD interface 14 elementi
  19. SD interface 6 elementi
  20. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 2 elementi
Operating Temperature
  1. -20°C ÷ +60°C 9 elementi
  2. -40°C ÷ +85°C 10 elementi
  3. 0°C ÷ +50°C 11 elementi
  4. 0°C ÷ +60°C 14 elementi
  5. 20°C ÷ +70°C 10 elementi
Pci Express
  1. PCI-e lanes ≥ 1 12 elementi
  2. PCI-e lanes ≥ 2 7 elementi
  3. PCI-e lanes ≥ 3 5 elementi
  4. PCI-e lanes ≥ 4 5 elementi
  5. PCI-e lanes ≥ 5 1 elemento
ScreenDimension
  1. TTL Uarts ≥1 1 elemento
Ttl Uarts
  1. TTL Uarts ≥1 10 elementi
  2. TTL Uarts ≥2 8 elementi
  3. TTL Uarts ≥3 6 elementi
USB
  1. USB 2.0 ≥ 1 13 elementi
  2. USB 2.0 ≥ 2 12 elementi
  3. USB 2.0 ≥ 3 10 elementi
  4. USB 2.0 ≥ 4 9 elementi
  5. USB 2.0 ≥ 5 5 elementi
  6. USB 2.0 ≥ 6 4 elementi
  7. USB 3.0 ≥ 1 8 elementi
  8. USB 3.0 ≥ 2 7 elementi
  9. USB 3.0 ≥ 3 1 elemento
  10. USB 3.0 ≥ 4 1 elemento
  11. USB 3.1 ≥ 1 1 elemento
  12. USB OTG 7 elementi
Video Interfaces
  1. DDI 1 elemento
  2. DP 4 elementi
  3. DP++ 3 elementi
  4. DUAL CHANNEL LVDS 13 elementi
  5. eDP 6 elementi
  6. HDMI 11 elementi
  7. MIPI-CSI camera conn 3 elementi
  8. MIPI-DSI 4 elementi
  9. SINGLE CHANNEL LVDS 14 elementi
  10. VGA 1 elemento
Wireless Connectivity
  1. ONBOARD WI-FI/BLE 6 elementi
  2. /Q/7/Q7-C26_70x70mm_1000x1000px_15_1.jpg 1 elemento
Prodotti
  • Computer on Module
  • Single Board Computer
  • Human Machine Interface
  • Fanless Embedded PCs
  • Embedded PCs
  • Payment Systems
  • Kit di sviluppo e accessori
  • AI-Optimized Hardware
  • Display TFT
  • Modular Vision
  • Dev Kits, Carrier Boards and Accessories
  • Evaluation Kit
  • Single Board Computer
  • Touch Display Solution