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  1. Mass Storage
    M.2 SATA SSD slot
  2. Video Interfaces
    eDP
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Opzioni
Cpu Maker
  1. Intel 8 elementi
Cpu Power Consumption
  1. range 10-25 W 1 elemento
  2. range < 10 W 2 elementi
Cpu Type
  1. Intel® Atom™ 5 elementi
  2. Intel® Celeron® 2 elementi
  3. Intel® Core™ 3 elementi
  4. Intel® Pentium® 2 elementi
Ethernet
  1. ETHERNET≥1 4 elementi
  2. ETHERNET≥2 6 elementi
Form Factor
  1. COM Express® 2 elementi
  2. COM-HPC® 2 elementi
  3. Single Board Computer 5 elementi
Form Factor Dimensions
  1. 120 x 95 mm (COM Express® Basic Form factor, Type 7 pinout) 3 elementi
  2. ≤ 100 x 100mm 4 elementi
  3. ≥ 100 x 100mm 1 elemento
Form Factor Specification
  1. COM Express Basic 2 elementi
  2. COM-HPC Client 2 elementi
  3. embedded NUC 1 elemento
  4. Pico-ITX 4 elementi
Memory
  1. memory ≤1 2 elementi
  2. memory ≤16 4 elementi
  3. memory ≤2 2 elementi
  4. memory ≤4 2 elementi
  5. memory ≤8 2 elementi
  6. memory ≥32 2 elementi
  7. soldered down 3 elementi
  8. SO_DIMM 1 elemento
Mass Storage
  1. onboard SSD 1 elemento
  2. standard SATA connector 7 elementi
  3. soldered down 1 elemento
  4. CFAST slot 2 elementi
  5. M.2 NVMe SSD slot 6 elementi
  6. M.2 SATA SSD slot 9 elementi
  7. microSD card slot 10 elementi
  8. onboard eMMC 25 elementi
  9. onboard eMMC 5 elementi
  10. SATA channels ≥ 1 22 elementi
  11. SATA channels ≥ 1 3 elementi
  12. SATA channels ≥ 2 1 elemento
  13. SATA channels ≥ 2 5 elementi
  14. SATA channels ≥ 2 17 elementi
  15. SATA channels ≥ 3 3 elementi
  16. SATA channels ≥ 4 1 elemento
  17. SD interface 6 elementi
  18. SD interface 2 elementi
  19. UFS 3.1 Gen4 2-lane drive soldered on-board, up to 1TB, boot device 1 elemento
Operating Temperature
  1. -20°C ÷ +60°C 1 elemento
  2. -40°C ÷ +85°C 4 elementi
  3. 0°C ÷ +50°C 1 elemento
  4. 0°C ÷ +60°C 8 elementi
  5. 20°C ÷ +70°C 1 elemento
Pci Express
  1. PCI-e lanes ≥ 1 1 elemento
  2. PCI-e lanes ≥ 2 1 elemento
  3. PCI-e lanes ≥ 3 1 elemento
  4. PCI-e lanes ≥ 5 4 elementi
Ttl Uarts
  1. TTL Uarts ≥2 1 elemento
USB
  1. USB 2.0 ≥ 1 1 elemento
  2. USB 2.0 ≥ 2 2 elementi
  3. USB 2.0 ≥ 3 3 elementi
  4. USB 2.0 ≥ 4 2 elementi
  5. USB 2.0 ≥ 5 1 elemento
  6. USB 3.0 ≥ 1 1 elemento
  7. USB 3.0 ≥ 2 2 elementi
  8. USB 3.0 ≥ 3 1 elemento
  9. USB 3.2 ≥ 2 1 elemento
  10. USB 4.0 ≥ 2 2 elementi
  11. USB 4.0 ≥ 4 1 elemento
  12. USB OTG 5 elementi
Video Interfaces
  1. DDI 3 elementi
  2. DP 9 elementi
  3. DP++ 13 elementi
  4. DUAL CHANNEL LVDS 7 elementi
  5. eDP 9 elementi
  6. HDMI 15 elementi
  7. MIPI-CSI camera conn 3 elementi
  8. MIPI-DSI 1 elemento
  9. SINGLE CHANNEL LVDS 5 elementi
Wireless Connectivity
  1. M.2 SOCKET 2 KEY 1 elemento
  2. M.2 Socket 2 key B 3 elementi
  3. ONBOARD WI-FI/BLE 2 elementi
Prodotti
  • Computer on Module
  • Single Board Computer
  • Human Machine Interface
  • Fanless Embedded PCs
  • Embedded PCs
  • Payment Systems
  • Kit di sviluppo e accessori
  • AI-Optimized Hardware
  • Display TFT
  • Modular Vision
  • Dev Kits, Carrier Boards and Accessories
  • Evaluation Kit
  • Single Board Computer
  • Touch Display Solution